Activities

Scocieties, Memberships, Awards

• The Institute of Electrical and Electronics Engineers (IEEE) and CPMT
• The New York Academy of Sciences
• German Society for Materials Research and Testing(DVM) Chairman of Committee for Microsystem Technology)
• American Society of Mechanical Engineers (ASME)
• Arnold-Sommerfeld Society for Physics (Germany)
• International Microelectronics and Packaging Society (IMAPS)
• Leibniz Award for Physics of Martin-Luther University Halle-Wittenberg
• ASME-EEPD Award for outstanding achievement in mechanical (‚physical") design of electronic packaging.

Organizing Committees etc. (selected)

Organizing committee member, general chairman/co-chairman for various meetings, conferences, symposia

• General Chair of International Conferences on Micro Materials "MicroMat" 1995, 1997, 2000
• Co-Chair of Poly ’98 (Paris), Poly ’99 (Paris) and Poly 2000 (London)
• Co-Chair of European Conference E-MRS Symposium on Microsystems, Strasbourg, 2001
• Chairman of Symposium of European Conference EUROMAT 2000, Munich, Testing and Reliability of Microsystems
• Member of about 20 Program Committees of international and national events, e.g.Microsystem Technology Conferences (two-annually)
• Surface Mount Technology (annually)
• ECTC Reliability Committee
• Microfactory Workshops in Tsukuba (Japan) and Fribourg (Switzerland)