Scocieties, Memberships, Awards

  • The Institute of Electrical and Electronics Engineers (IEEE) and CPMT
  • The New York Academy of Sciences
  • German Society for Materials Research and Testing(DVM) Chairman of Committee for Microsystem Technology)
  • American Society of Mechanical Engineers (ASME)
  • Arnold-Sommerfeld Society for Physics (Germany)
  • International Microelectronics and Packaging Society (IMAPS)
  • Leibniz Award for Physics of Martin-Luther University Halle-Wittenberg
  • ASME-EEPD Award for outstanding achievement in mechanical (‚physical") design of electronic packaging.

Organizing Committees etc. (selected)

Organizing committee member, general chairman/co-chairman for various meetings, conferences, symposia

  • General Chair of International Conferences on Micro Materials "MicroMat" 1995, 1997, 2000
  • Co-Chair of Poly ’98 (Paris), Poly ’99 (Paris) and Poly 2000 (London)
  • Co-Chair of European Conference E-MRS Symposium on Microsystems, Strasbourg, 2001
  • Chairman of Symposium of European Conference EUROMAT 2000, Munich, Testing and Reliability of Microsystems
  • Member of about 20 Program Committees of international and national events, e.g.Microsystem Technology Conferences (two-annually)
  • Surface Mount Technology (annually)
  • ECTC Reliability Committee
  • Microfactory Workshops in Tsukuba (Japan) and Fribourg (Switzerland)

To top