Image Correlation Techniques for Microsaytem Inspection |
Vogel, D.;... |
in: Optical Inspection of... |
2006 |
55-102 |
Microsecurity- Sicherheit durch Miniaturisierung mit sensorik und Mikrosyst... |
Michel,B.,... |
Proc. 2. BMBF Workshop... |
2006 |
48-49 |
NanoDAC- a New Technique for Nano-Deformation and Nano-Reliability Analysis |
Michel, B. |
MST News, VDI/VDE-IT 2006,... |
2006 |
37 |
Progress in Reliability Research in the Micro and Nano Region |
Wunderle, B.;... |
Microelectronics Reliability... |
2006 |
1685 |
Zuverlässige Bauteile mit neuen Werkstoffen |
Michel,B. |
in:Wirtschaftsstandort... |
2006 |
176 |
Zuverlässigkeit von Automobilelektronik und Sensorik durch Einsatz moderner... |
Michel,B. |
Konferenzmaterialien... |
2006 |
2 |
Advancedd Sensor Technologies for Nondestructive Evaluation and Structural ... |
Meyendorf,N.;Ba... |
Proceedings of SPIE, |
2005 |
224 p. |
Experimental Mechanics on the Way from Micro to Nano |
Michel, B. |
Experimental Technique, vol.... |
2005 |
3-5 |
Micromaterials, Nanomaterials for Automotives |
Michel, B.... |
Proc. onf. Microcar 2005, in:... |
2005 |
107 p. |
Microreliability, Nanoreliability- Reliability Approach for the Micro-Nano ... |
Michel,B. |
in: MicroSystem Technologies... |
2005 |
223-226 |
Mikroprüftechnik, in "Kunststoffprüfung" (ed. W. Grellmann and S. Seidler) |
Michel, B.,... |
Carl Hanser Verlag, München,... |
2005 |
665-686 |
Nanodeformation Analysis near Small Cracks by means of NanoDAC Technique |
Keller,J.;... |
G. Wilkening and L. Koenders... |
2005 |
481-494 |
Nanodeformation Analysis Near Small Cracks by Means of nanoDAC Technique |
Michel,B.,... |
in: G. Wilkening and L.... |
2005 |
481-489 |
Nanoreliability- Lifetime Estimation for Nanotechnology Applications Based ... |
Michel,B.,... |
in.: Nanofair 2005- Neue... |
2005 |
93-96 |
Reliability Research on the Way from Micro to Nano |
Michel,B. |
in: Proceedings 1st Int.... |
2005 |
43-45 |
Testing, Reliability, and Application of Micro-and Nano-Materials SYstems I... |
Geer,R.E.;Meyen... |
Proceedings of SPIE, vol. 5766 |
2005 |
178 pp. |
Auf Biegen und Brechen- Zuverlässigkeit von Mikro- und Nanosystemen" |
Dual, J.,... |
Bulletin der ETH Zürich, No.... |
2004 |
57-60 |
MicroDAC - ein Meßverfahren zur Ermittlung von Werkstoffeigenschaften im Mi... |
Keller, J.;... |
VDI-Berichte Nr. 1829 (2004) |
2004 |
433-440 |
Micromaterials and Nanomaterials |
Michel,B. (ed.) |
Publication Series, vol. No.... |
2004 |
- |
Microreliability and Nanoreliability for MEMS |
Michel, B. |
Knobloch,H.; Kaminorz, Y.... |
2004 |
269-276 |
Microsecurity- Important Cababilities for Homeland Security Challenges |
Michel, B.,... |
MST News, Dec.2004 |
2004 |
2 |
Verfahren zur feldmässigen Bestimmung von Deformationszuständen in mikrosko... |
Kuehnert,R.,... |
Deutsches Patent Nr. 196 14... |
2004 |
- |
Zuverlässigkeitsbewertung elektronischer Baugruppen mit modernen Mikro- und... |
Michel,B.,... |
in GMM-Fachberichte ... |
2004 |
99-112 |
Computational Assessment of Interconnection Technology for High Power, High... |
Kaulfersch,E.,... |
Proc. Internat. Conf. on High... |
2003 |
79-86 |
Evaluation microdefected structures by AFM-based deformation measurement |
Vogel,D.,... |
Proc. SPIE, vol. 5045, ed.... |
2003 |
1-12 |
Microreliability, Nanoreliability- Reliability Issues for MEMS |
Michel,B, |
in: H.Knobloch and Y.... |
2003 |
269-275 |
Reliability of Micro- and Nanosystems |
Michel,B. |
Proc. 2nd. VDE World... |
2003 |
365-368 |
reliability Prediction of Area Array Solder Joints |
Dudek,R.,Doerin... |
Transactions of ASME,Journal... |
2003 |
562-568 |
Risse in Packagingaufbauten - von der Mikromechanik zur Nanomechanik |
Michel, B.;... |
in. K.-J. Wolter u. S. ... |
2003 |
245 - 254 |
Zuverlässigkeit von Komponenten der Mikro- und Nanomechatronik |
Michel,B. |
Proc. DVM Arbeitskreis... |
2003 |
300 |
Charakterisierung von Bruchvorgängen in Mikrosystemen mit MicroDAC- und Nan... |
Michel, B.;... |
DVM-AK Bruchvorgänge:... |
2002 |
- |
Generalized Fracture Mechanical Integral Concept JG and its Application in ... |
Ghafvifekr,... |
Sensors and Actuators A 99,... |
2002 |
183-187 |
Generalized Mechanical Integral Concept JG and its Application in Microelec... |
Ghavifekr,H.B.,... |
Senors and Actuators A99(2002) |
2002 |
183-187 |
Micro Materials Center Berlin |
Michel, B.;... |
Micromaterials and... |
2002 |
4 - 7
|
Micromaterials and Nanomaterials |
Michel, B.;... |
Series Micromaterials and... |
2002 |
72 |
Mikroverformungsanalyse mit dem nanoDAC-Verfahren |
Michel, B.;... |
SFB TU Chemnitz |
2002 |
- |
Microcrack Evaluation for Electronic Components by AFM nanoDAC Deformation ... |
Vogel,D.,... |
Proc. 1st. IEEE Conference on... |
2001 |
309-312 |
Micro Materials |
Michel, B.;... |
Proceedings of 3rd Int. Conf.... |
2000 |
- |
Mechanical Property Measurements – Lessons Learned from the Microelectronic... |
Michel, B. |
Int. Conf. on Metallurgical... |
1999 |
93 |
Packaging and Thermomechanical Challenges for High Temperature Electronics |
Michel, B.;... |
HITEN `99 European Conf. On... |
1999 |
33 |
Polytronik-Einsatzgebiete von Kunststoffen in der Elektronik unter besonder... |
Michel, B.... |
7. Problemseminar... |
1999 |
3 |
Der Einsatz von Mikro- und Nanowerkstoffen – Grundlage für die Miniaturisie... |
Michel, B.;... |
13. Int. Wiss. Konferenz, HTW... |
1998 |
125 – 128 |
Improvement of the Thermo-Mechanical Performance of Advanced Packages by Ex... |
Michel, B.;... |
Workshop Mechanical... |
1998 |
87 – 94 |
Mechanical Properties of Microsystem Components |
Michel, B.;... |
SPIE 43rd Annual Meeting;... |
1998 |
- |
Mechanische Zuverlässigkeit von Werkstoffverbunden in der Mikrosystemtechni... |
Michel, B.;... |
Werkstoffwoche `98, München,... |
1998 |
- |
Reliability Aspects of Microassembly in Microfactories |
Michel, B.;... |
Int. Workshop on... |
1998 |
13 |
Thermo-Mechanical Analysis of Microelectronic Components and Chipcards |
Michel, B.;... |
11th. Int. Conf. On... |
1998 |
965 – 968 |
Thermomechanische Untersuchungen zur Zuverlässigkeitserhöhung von Mikrosyst... |
Michel, B.;... |
Fachtagung Informations- und... |
1998 |
16 – 23 |
Fracture Electronics - Concepts of Fracture Mechanics for Reliability |
Michel, B. |
Abstract Volume: Micro... |
1997 |
203 - 204 |
Miniaturisierung und Werkstoffverbunde - Probleme und Lösungsmöglichkeiten ... |
Michel, B.;... |
in: K. Friedrich (ed.):... |
1997 |
493 - 497 |