Reliability Issues for Smart Systems Integration on the Way from Micro to ... |
Michel,B. |
VDE Verlag Berlin,... |
2007 |
303-306 |
Zuverlässigkeitsprobleme im Hightech -Bereich- Lösungsansätze und Konzepte |
Michel,B. |
Sitzungsberichte der... |
2007 |
229-237 |
Zuverlässige Bauteile mit neuen Werkstoffen |
Michel,B. |
in:Wirtschaftsstandort... |
2006 |
176 |
Zuverlässigkeit von Automobilelektronik und Sensorik durch Einsatz moderner... |
Michel,B. |
Konferenzmaterialien... |
2006 |
2 |
Microreliability, Nanoreliability- Reliability Approach for the Micro-Nano ... |
Michel,B. |
in: MicroSystem Technologies... |
2005 |
223-226 |
Reliability Research on the Way from Micro to Nano |
Michel,B. |
in: Proceedings 1st Int.... |
2005 |
43-45 |
Reliability of Micro- and Nanosystems |
Michel,B. |
Proc. 2nd. VDE World... |
2003 |
365-368 |
Zuverlässigkeit von Komponenten der Mikro- und Nanomechatronik |
Michel,B. |
Proc. DVM Arbeitskreis... |
2003 |
300 |
Micromaterials and Nanomaterials |
Michel,B. (ed.) |
Publication Series, vol. No.... |
2004 |
- |
A Tribute to Albert Einstein |
Michel,B.(ed.) |
Micromaterials and... |
2006 |
64 p. |
Zuverlässigkeitsbewertung elektronischer Baugruppen mit modernen Mikro- und... |
Michel,B.,... |
in GMM-Fachberichte ... |
2004 |
99-112 |
Nanodeformation Analysis Near Small Cracks by Means of nanoDAC Technique |
Michel,B.,... |
in: G. Wilkening and L.... |
2005 |
481-489 |
Nanoreliability- Lifetime Estimation for Nanotechnology Applications Based ... |
Michel,B.,... |
in.: Nanofair 2005- Neue... |
2005 |
93-96 |
Microsecurity- Sicherheit durch Miniaturisierung mit sensorik und Mikrosyst... |
Michel,B.,... |
Proc. 2. BMBF Workshop... |
2006 |
48-49 |
Micro- and Nanoreliability Research in the MicroMaterials Center Chemnitz o... |
Michel,B.;... |
MST News 2/09 |
2009 |
40- 41 |
Micro-Deformation Analysis and Reliability Estimation of Micro-Components b... |
Michel,B.;... |
in:E.Suhir,Y.C. Lee, C.P.... |
2007 |
233-250 |
Über das Wechselverhältnis von Kontinuumsmechanik und Strukturphysik fester... |
Michel,B.;... |
Reihe Fracture Mechanics,... |
1984 |
1-180 |
Micromaterials & Nanomaterials
Proceedings Internat. Conference MicroCar ... |
Michel,B.;... |
Series Micromaterials &... |
2013 |
1-200 |
Nanoreliability- Reliability Concepts for Micro-Nano-interface Regins |
Michel,B.;... |
MicroMaterials&... |
2007 |
60-61 |
EUCEMAN- The European Center for Microreliability and Nanoreliability |
Michel,B.;... |
Micromaterials &... |
2007 |
92-93 |
Micro- and Nanosecurity: Security by Miniaturization in MST |
Michel,B.;... |
Proc. VDE ,... |
2007 |
63-65 |
Neue Möglichkeiten und Trends moderner Prüftechniken unter besonderer Beach... |
Michel,B.;Rzepk... |
PLUS-Produktion von... |
2014 |
562-572 |
Nanozuverlässigkeit in Verbindung zur Nanoanalytik |
Michel,B.;Rzepk... |
Fachbuch Nanotechnologie ,... |
2012 |
4 |
Möglichkeiten der Bruchmechanik für die Schadensvermeidung in den Bereichen... |
Michel,B.;Winkl... |
Scientific Reports , Univ. of... |
2012 |
3-5 |
German Association of Nanotechnology: Objectives and Benefits |
Nonninger, R.;... |
Smart Systems Integration for... |
2014 |
353-357 |
Mechanism of Moisture Diffusion, Hygroscopic Swelling and Adhesion Degradat... |
Shirangi ,... |
Moisture Sensitivity of... |
2010 |
29-69 |
Advanced Virtual Testing of Structural Integrity in Microelectronics |
Shirangi,M.H.;M... |
Proceedings MicroCar 2011,... |
2011 |
im Druck |
Image Correlation Techniques for Microsaytem Inspection |
Vogel, D.;... |
in: Optical Inspection of... |
2006 |
55-102 |
Patent : Verfahren zur Lokalen Eigenspannungsbewertung im Nanobereich mitte... |
Vogel,D.,... |
N/A |
0000 |
N/A |
Evaluation microdefected structures by AFM-based deformation measurement |
Vogel,D.,... |
Proc. SPIE, vol. 5045, ed.... |
2003 |
1-12 |
Microcrack Evaluation for Electronic Components by AFM nanoDAC Deformation ... |
Vogel,D.,... |
Proc. 1st. IEEE Conference on... |
2001 |
309-312 |
FIBDAC StressRelief - a New Method to Access Stress on Patterned Si Wafer |
Vogel,D.;Gollha... |
Proceedings MicroCar 2011,... |
2011 |
in print |
TeSiMat- Inno Profile Junior Research Group- a Short Report |
Winkler, T.;... |
in: Micromaterials and... |
2009 |
134-135 |
Mechanische und thermische Simulation in der Aufbau- und Verbindungstechnik |
Wittler, O.;... |
Systemintegration in der... |
2011 |
57-64 |
Progress in Reliability Research in the Micro and Nano Region |
Wunderle, B.;... |
Microelectronics Reliability... |
2006 |
1685 |