Neue Möglichkeiten und Trends moderner Prüftechniken unter besonderer Beach... |
Michel,B.;Rzepk... |
PLUS-Produktion von... |
2014 |
562-572 |
Nanozuverlässigkeit in Verbindung zur Nanoanalytik |
Michel,B.;Rzepk... |
Fachbuch Nanotechnologie ,... |
2012 |
4 |
Nanoreliability- Reliability Research for Microsystem Technology on the Way... |
Michel, B. |
MST News Berlin no 4/08 |
2008 |
28 |
Nanoreliability- Reliability Concepts for Micro-Nano-interface Regins |
Michel,B.;... |
MicroMaterials&... |
2007 |
60-61 |
Nanoreliability- Lifetime Estimation for Nanotechnology Applications Based ... |
Michel,B.,... |
in.: Nanofair 2005- Neue... |
2005 |
93-96 |
Nanodeformation Analysis near Small Cracks by means of NanoDAC Technique |
Keller,J.;... |
G. Wilkening and L. Koenders... |
2005 |
481-494 |
Nanodeformation Analysis Near Small Cracks by Means of nanoDAC Technique |
Michel,B.,... |
in: G. Wilkening and L.... |
2005 |
481-489 |
NanoDAC- a New Technique for Nano-Deformation and Nano-Reliability Analysis |
Michel, B. |
MST News, VDI/VDE-IT 2006,... |
2006 |
37 |
Möglichkeiten der Bruchmechanik für die Schadensvermeidung in den Bereichen... |
Michel,B.;Winkl... |
Scientific Reports , Univ. of... |
2012 |
3-5 |
MMCB- The Micro Materials Center Berlin and Chemnitz at Fraunhofer IZM |
Michel,B. |
in: Micromaterials &... |
2007 |
94-95 |
Miniaturisierung und Werkstoffverbunde - Probleme und Lösungsmöglichkeiten ... |
Michel, B.;... |
in: K. Friedrich (ed.):... |
1997 |
493 - 497 |
Mikroverformungsanalyse mit dem nanoDAC-Verfahren |
Michel, B.;... |
SFB TU Chemnitz |
2002 |
- |
Mikroprüftechnik, in "Kunststoffprüfung" (ed. W. Grellmann and S. Seidler) |
Michel, B.,... |
Carl Hanser Verlag, München,... |
2005 |
665-686 |
Mikro-Moiré-Methode und MicroDAC-Verfahren anwenden |
Michel, B.;... |
Materialprüfung Heft 6/96,... |
1996 |
- |
Mikro-Baugruppen mechanisch prüfen |
Michel, B.;... |
Materialprüfung 36, 1-2 |
1994 |
36 - 39 |
Microsecurity- Sicherheit durch Miniaturisierung mit sensorik und Mikrosyst... |
Michel,B.,... |
Proc. 2. BMBF Workshop... |
2006 |
48-49 |
Microsecurity- Sicherheit durch Mikro- und Nanotechnologien |
Michel, B. |
Proc. Silicon Saxony Day 2009 |
2009 |
10 |
Microsecurity- Important Cababilities for Homeland Security Challenges |
Michel, B.,... |
MST News, Dec.2004 |
2004 |
2 |
Microsecurity, Nanosecurity- Security research in Europe Utulizing Advanced... |
Michel, B.;... |
Proc. 3rd. Leibniz Conference... |
2007 |
84-85 |
Microsecurity and Nanosecurity- Security Research Using the Advantages of S... |
Michel, B.;... |
Smart System Integration... |
2008 |
119-120 |
Microreliability, Nanoreliability- Reliability Issues for MEMS |
Michel,B, |
in: H.Knobloch and Y.... |
2003 |
269-275 |
Microreliability, Nanoreliability- Reliability Approach for the Micro-Nano ... |
Michel,B. |
in: MicroSystem Technologies... |
2005 |
223-226 |
Microreliability and Nanoreliability for MEMS |
Michel, B. |
Knobloch,H.; Kaminorz, Y.... |
2004 |
269-276 |
MicroNanoReliability 2008 |
Michel, B.... |
Series Micromaterials and... |
2007 |
315 |
Micromaterials, Nanomaterials for Automotives |
Michel, B.... |
Proc. onf. Microcar 2005, in:... |
2005 |
107 p. |
Micromaterials and Nanomaterials |
Michel,B. (ed.) |
Publication Series, vol. No.... |
2004 |
- |
Micromaterials and Nanomaterials |
Michel, B.;... |
Series Micromaterials and... |
2002 |
72 |
Micromaterials & Nanomaterials
Proceedings Internat. Conference MicroCar ... |
Michel,B.;... |
Series Micromaterials &... |
2013 |
1-200 |
MicroDAC - ein Meßverfahren zur Ermittlung von Werkstoffeigenschaften im Mi... |
Keller, J.;... |
VDI-Berichte Nr. 1829 (2004) |
2004 |
433-440 |
Microcrack Evaluation for Electronic Components by AFM nanoDAC Deformation ... |
Vogel,D.,... |
Proc. 1st. IEEE Conference on... |
2001 |
309-312 |
Micro-Deformation Analysis and Reliability Estimation of Micro-Components b... |
Michel,B.;... |
in:E.Suhir,Y.C. Lee, C.P.... |
2007 |
233-250 |
Micro- and Nanosecurity: Security by Miniaturization in MST |
Michel,B.;... |
Proc. VDE ,... |
2007 |
63-65 |
Micro- and Nanoreliability Research in the MicroMaterials Center Chemnitz o... |
Michel,B.;... |
MST News 2/09 |
2009 |
40- 41 |
Micro Materials Center Berlin |
Michel, B.;... |
Micromaterials and... |
2002 |
4 - 7
|
Micro Materials |
Michel, B.;... |
Proceedings of 3rd Int. Conf.... |
2000 |
- |
Mechanism of Moisture Diffusion, Hygroscopic Swelling and Adhesion Degradat... |
Shirangi ,... |
Moisture Sensitivity of... |
2010 |
29-69 |
Mechanische Zuverlässigkeit von Werkstoffverbunden in der Mikrosystemtechni... |
Michel, B.;... |
Werkstoffwoche `98, München,... |
1998 |
- |
Mechanische und thermische Zuverlässigkeit von Komponenten und Bauteilen de... |
Michel, B.;... |
Proc. Microengineering,... |
1994 |
35 |
Mechanische und thermische Simulation in der Aufbau- und Verbindungstechnik |
Wittler, O.;... |
Systemintegration in der... |
2011 |
57-64 |
Mechanical reliability of micro-components in electronics and microsystem t... |
Michel, B.;... |
Technology, Law and Insurance... |
1996 |
29 - 35 |
Mechanical Reliability of Chipcards |
Michel, B.;... |
12. Int. Mittweidaer... |
1996 |
51 - 59 |
Mechanical Reliability Analysis of Microcomponents |
Michel, B. |
Proc. of the 4th Intern.... |
1994 |
- |
Mechanical Property Measurements – Lessons Learned from the Microelectronic... |
Michel, B. |
Int. Conf. on Metallurgical... |
1999 |
93 |
Mechanical Properties of Microsystem Components |
Michel, B.;... |
SPIE 43rd Annual Meeting;... |
1998 |
- |
Improvement of the Thermo-Mechanical Performance of Advanced Packages by Ex... |
Michel, B.;... |
Workshop Mechanical... |
1998 |
87 – 94 |
Image Correlation Techniques for Microsaytem Inspection |
Vogel, D.;... |
in: Optical Inspection of... |
2006 |
55-102 |
German Association of Nanotechnology: Objectives and Benefits |
Nonninger, R.;... |
Smart Systems Integration for... |
2014 |
353-357 |
Generalized Mechanical Integral Concept JG and its Application in Microelec... |
Ghavifekr,H.B.,... |
Senors and Actuators A99(2002) |
2002 |
183-187 |
Generalized Fracture Mechanical Integral Concept JG and its Application in ... |
Ghafvifekr,... |
Sensors and Actuators A 99,... |
2002 |
183-187 |
Fracture Electronics - Fracture problems in electronic packaging |
Michel, B.;... |
European Conference on... |
1996 |
106 - 107 |