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Title Author(s) Where published? Year Page(s)
A Tribute to Albert Einstein Michel,B.(ed.) Micromaterials and... 2006 64 p.
Advanced Virtual Testing of Structural Integrity in Microelectronics Shirangi,M.H.;M... Proceedings MicroCar 2011,... 2011 im Druck
Advancedd Sensor Technologies for Nondestructive Evaluation and Structural ... Meyendorf,N.;Ba... Proceedings of SPIE, 2005 224 p.
Aktivitäten zur Zuverlässigkeit von Nanotechnologien Michel, B.;... Nanotechnologie Aktuell, vol.... 2014 104-107
Application of Fracture Mechanics to Micromechanics and Microsystem Technol... Michel, B.;... Advances in Fracture Research... 1994 683 - 690
Application of Solid Mechanics in the Fields of Microelectronics and Micro ... Michel, B.;... 2nd European Solid Mechanics... 1994 N9
Auf Biegen und Brechen- Zuverlässigkeit von Mikro- und Nanosystemen" Dual, J.,... Bulletin der ETH Zürich, No.... 2004 57-60
Basic thermo-mechanical property estimation of a 3D- crosslinked epoxy/SiO... Hoelck,O.;Dermi... Microelectronics Reliability... 2011 1027-1034
Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture ... Auersperg,J.;... Proc. 7th. Int. Conference on... 2007 309
Chances and Limits of Computer Tomography in Materialographic Investigatio... Faust,W.;Noack,... Practical Metallography Carl... 2012 328-342
Charakterisierung von Bruchvorgängen in Mikrosystemen mit MicroDAC- und Nan... Michel, B.;... DVM-AK Bruchvorgänge:... 2002 -
Charakterisierung von Werkstoffverbunden für neue Einsatzmöglichkeiten im B... Michel, B.;... Proc. Werkstoffwoche '96 1996 -
Charakterisierung von Werkstoffverbundunden für neue Einsatzmöglichkeiten i... Michel, B.;... Proc. Werkstoffwoche '96,... 1996 233 - 239
Comparative Characterization of Chip Epoxy Interfaces by Molecular Modeling... Hoelck,O.;... Microelectronics... 2012 1285-1290
Computational Assessment of Interconnection Technology for High Power, High... Kaulfersch,E.,... Proc. Internat. Conf. on High... 2003 79-86
Das MicroDAC-Verfahren - eine Methode zur quantitativen Verformungsbewertun... Michel, B.;... Proc. 2. Chemnitzer... 1995 31 - 35
Der Einsatz von Mikro- und Nanowerkstoffen – Grundlage für die Miniaturisie... Michel, B.;... 13. Int. Wiss. Konferenz, HTW... 1998 125 – 128
Editorial for invited paper "RF MEMS:An Enabling Technology for Modern Wir... Michel,B. Microsystem Technologies voll... 2015 1
Eigenspannungen in Verbundwerkstoffen der Mikrosystemtechnik Michel, B. in: G. Ziegler,... 1996 223 - 224
Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik Michel, B. Proc. Tagung... 1995 96
Erhöhung der Zuverlässigkeit von Mikro- und Nanokomponenten und Systemen du... Michel,... Microelectronic Packaging in... 2014 309-312
EUCEMAN- The European Center for MicroNanoReliability Research in Europe Michel, B.;... Smart Systems Integration for... 2014 703-708
EUCEMAN- The European Center for Microreliability and Nanoreliability Michel, B. MST News Berlin No 4/08 2008 41
EUCEMAN- The European Center for Microreliability and Nanoreliability Michel, B. MST News Berlin No 4/08 2008 41
EUCEMAN- The European Center for Microreliability and Nanoreliability Michel,B.;... Micromaterials &... 2007 92-93
EUCEMAN- The European Center on Micro-Nano-Reliability Michel, B.;... Publication of LIFIS, Leibniz... 2012 1-5
Evaluation microdefected structures by AFM-based deformation measurement Vogel,D.,... Proc. SPIE, vol. 5045, ed.... 2003 1-12
Evaluation of Microdeformations and Fracture Quantities by Means of Micro M... Michel, B.;... Proc. 10th Intern. Conf.... 1994 39 - 44
Experimental and Numerical Deformation Analysis on Components of Microsyste... Michel, B.;... Proc. 1st European Conf. on... 1994 122 - 124
Experimental and Numerical Investigations of Thermomechanically Stressed Mi... Michel, B.;... Micro System Technologies 1 1994 14 - 22
Experimental Mechanics on the Way from Micro to Nano Michel, B. Experimental Technique, vol.... 2005 3-5
Experimentelle und numerische Deformationsanalyse an Komponenten der Mikros... Michel, B.;... Deutscher Verband für... 1994 122 - 125
FIBDAC StressRelief - a New Method to Access Stress on Patterned Si Wafer Vogel,D.;Gollha... Proceedings MicroCar 2011,... 2011 in print
Fracture Electronics - Bruchmechanik angewendet auf Chipkarten, Leiterplatt... Michel, B.;... Proc. 28. Jahrestagung des AK... 1996 10
Fracture Electronics - Concepts of Fracture Mechanics for Reliability Michel, B. Abstract Volume: Micro... 1997 203 - 204
Fracture Electronics - Fracture problems in electronic packaging Michel, B.;... European Conference on... 1996 106 - 107
Generalized Fracture Mechanical Integral Concept JG and its Application in ... Ghafvifekr,... Sensors and Actuators A 99,... 2002 183-187
Generalized Mechanical Integral Concept JG and its Application in Microelec... Ghavifekr,H.B.,... Senors and Actuators A99(2002) 2002 183-187
German Association of Nanotechnology: Objectives and Benefits Nonninger, R.;... Smart Systems Integration for... 2014 353-357
Image Correlation Techniques for Microsaytem Inspection Vogel, D.;... in: Optical Inspection of... 2006 55-102
Improvement of the Thermo-Mechanical Performance of Advanced Packages by Ex... Michel, B.;... Workshop Mechanical... 1998 87 – 94
Mechanical Properties of Microsystem Components Michel, B.;... SPIE 43rd Annual Meeting;... 1998 -
Mechanical Property Measurements – Lessons Learned from the Microelectronic... Michel, B. Int. Conf. on Metallurgical... 1999 93
Mechanical Reliability Analysis of Microcomponents Michel, B. Proc. of the 4th Intern.... 1994 -
Mechanical Reliability of Chipcards Michel, B.;... 12. Int. Mittweidaer... 1996 51 - 59
Mechanical reliability of micro-components in electronics and microsystem t... Michel, B.;... Technology, Law and Insurance... 1996 29 - 35
Mechanische und thermische Simulation in der Aufbau- und Verbindungstechnik Wittler, O.;... Systemintegration in der... 2011 57-64
Mechanische und thermische Zuverlässigkeit von Komponenten und Bauteilen de... Michel, B.;... Proc. Microengineering,... 1994 35
Mechanische Zuverlässigkeit von Werkstoffverbunden in der Mikrosystemtechni... Michel, B.;... Werkstoffwoche `98, München,... 1998 -
Mechanism of Moisture Diffusion, Hygroscopic Swelling and Adhesion Degradat... Shirangi ,... Moisture Sensitivity of... 2010 29-69
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