FIBDAC StressRelief - a New Method to Access Stress on Patterned Si Wafer |
Vogel,D.;Gollha... |
Proceedings MicroCar 2011,... |
2011 |
in print |
Fracture Electronics - Concepts of Fracture Mechanics for Reliability |
Michel, B. |
Abstract Volume: Micro... |
1997 |
203 - 204 |
Fracture Electronics - Bruchmechanik angewendet auf Chipkarten, Leiterplatt... |
Michel, B.;... |
Proc. 28. Jahrestagung des AK... |
1996 |
10 |
Fracture Electronics - Fracture problems in electronic packaging |
Michel, B.;... |
European Conference on... |
1996 |
106 - 107 |