Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics

Internal ID	92
Author(s)	Auersperg,J.; Michel, B.
Where published?	Proc. 7th. Int. Conference on Electronic Packaging Technology, China August 2006
Year	2007
Page(s)	309