| Internal ID | 37 |
|---|---|
| Author(s) | Michel, B.; Vogel, D.; Schubert, A.; Auersperg, J.; Reichl, H. |
| Where published? | Symposium on Applications of Experimental Mechanics to Electronic Packaging at the 1997ASME In. Mechanical Engineering Congress and Exposition |
| Year | 1997 |
| Page(s) | - |