Basic thermo-mechanical property estimation of a 3D- crosslinked epoxy/SiO2 interface using molecular modeling

Internal ID	114
Author(s)	Hoelck,O.;Dermitzaki,E.; Wunderle,B.; Bauer, J.; Michel, B.
Where published?	Microelectronics Reliability No. 51(2011)
Year	2011
Page(s)	1027-1034