Mechanism of Moisture Diffusion, Hygroscopic Swelling and Adhesion Degradation in Epoxy Molding Compounds
Internal ID
107
Author(s)
Shirangi , M.H.;Michel, B.
Where published?
Moisture Sensitivity of Plastic Packages of IC Devices, ed. X.J.Fan, E. Suhir, Springer Series on Micro- and Optoelectronic Materials, Heidelberg, New York