FIBDAC StressRelief - a New Method to Access Stress on Patterned Si Wafer

Internal ID	117
Author(s)	Vogel,D.;Gollhardt,A.;Rzepka,S.;Michel,B.
Where published?	Proceedings MicroCar 2011, Leipzig 2011, in: Publication Series Micro-and Nanomaterials (M&N), Fraunhofer Institutes ENAS and IZM, No.11
Year	2011
Page(s)	in print