Experimental and Numerical Deformation Analysis on Components of Microsystem Technology

Internal ID	19
Author(s)	Michel, B.; Kühnert, R.; Auersperg, J.; Tränkner, K
Where published?	Proc. 1st European Conf. on Electronic Packaging Technology (EuPAC '94), Essen
Year	1994
Page(s)	122 - 124