| Crack and delamination Risk Evaluation of thin Silicon Based Microelec... |
Auersperg,J.,... |
11th. Internat. Conf.... |
Torino,... |
03/2005 |
| Combination of Finite Element Simulation with Micro Deformation Measur... |
Michel, B.;... |
Conf. MICROSIM '95 |
Southampton,... |
10/1995 |
| Crack Avoidance and Crack Evaluation in Mikrosystems |
Michel, B. |
Int. Conf. Mikrosystem... |
Postdam,... |
12/1998 |
| Characterization approaches of nanoscale modified plastics |
Vogel,D.,... |
4th IEEE Conference on... |
Munich |
08/2004 |
| Clean Sky-europäische Technologiedemonstration
für grüneren Luftverke... |
Kaulfersch,... |
Internat. Conference... |
Leipzig |
02/2013 |
| Capabilities of Incorporating Bulk Fracture, Bimaterial Interface and ... |
Auersperg, J.;... |
7th. Internat. Conf.... |
ICEPT 2006,... |
08/2006 |
| Collaborative Research Amount Institutes, SME's & Multi-Nationals; inv... |
Michel, B. |
Management Research... |
Edinburgh |
04/2004 |
| Clearingstelle für Automobilelektronik Berlin- Wissenschaftliche Kompe... |
Michel,B. |
13.... |
Berlin |
01/2006 |
| Cracks in Micro- and nanoelectronics |
Michel, B.,... |
Symposium, 16.... |
Alexandroupo... |
06/2006 |
