| FIBDAC-ein leistungsfähiges Messverfahren zur ermittlung von lokalen E... |
Michek,B. |
ITG Conferenz... |
Grainau |
01/1970 |
| Fracture Mechanics Characterization of Micro-and Nanofilled Polymers b... |
Vogel,D.,Keller... |
World Congress... |
Munich |
01/1970 |
| Fatigue Crack Evaluation in Electronics |
Michel, B.;... |
12th International... |
Miskolc |
03/1994 |
| Fracture Electronics - Fracture Analysis of Microelectronic Components |
Michel, B.;... |
11th European... |
Futuroscope,... |
09/1996 |
| Fracture Electronics - Application of Fracture Mechanics to Microelect... |
Michel, B.;... |
9th International... |
Sydney,... |
04/1997 |
| Fracture elektronics and thermomechanical compatibility (TMC) of micro... |
Michel, B. |
3rd Int. Conf.... |
Berlin,... |
04/2000 |
| From Microreliability to Nanoreliability-Testing Concepts and Simulati... |
Michel,B. |
1. Internat. Conf. on... |
Berlin,... |
05/2003 |
| Fracture mechanical characterization of micro-and nanofilled polymers ... |
Wunderle,B.,... |
4th. IEEE Conference... |
Munich |
08/2004 |
| Fracture Mechanical Characterization of Microcracks by Application of ... |
Keller,J.,... |
5th. European Symp. on... |
Hueckelhofen |
09/2004 |
| Fracture and Fatigue Behaviour of MEMS-Related Micromaterials |
Walter,H.,... |
11.International... |
Torino,... |
03/2005 |
| From Microelectronics to Nanoelectronics- Reliability and Packaging Is... |
Michel,B.;Reich... |
SEMI, Nanoelectronics... |
Munich |
04/2006 |
| FIBDAC- ein leistungsfähiges Messverfahren zur Ermittlung von lokalen ... |
Michel,B. |
24. ITG Tagung... |
Grainau |
05/2006 |
| Fracture Mechanics- A Key to Micro- and Nanotechnology Reliability Ana... |
Michel, B. |
Karl Wieghardt &... |
Vienna,... |
03/2007 |
| FibDAC Stress Relief - a Novel Stress Measurement Approach for Semicon... |
Vogel, D;... |
Microtech/Nanotech... |
Anaheim, USA |
10/2010 |
| Fracture Mechanical Test Methods for Interface Crack Evaluation of
El... |
Keller,J.;... |
Microtech/Nanotech... |
Boston, USA |
06/2011 |
| Fracture toughness measurements for interaces in microelectronic packa... |
Maus, I.;... |
MSE-Materials and... |
Darmstadt |
09/2012 |
