Lectures

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Title Author(s) Event Location Date
Thermo-Mechanical Reliability of 3D-Integrated Microstructures in Stac... Wunderle,B.;Kau... MRS Annual Conference Boston, USA 11/2006
Testing at Micro and Nanoscale Michel,B. Invited Paper,... N√ľrnberg 05/2005
Thermomechanical Behaviour of Chipcard Materials Michel, B.;... 5th European... Maastricht,... 04/1997
Thermo-mechanical Reliability of Chip Size Packages Michel, B.;... Conference Microsystem... Potsdam,... 09/1996
Test, Characterization and Reliability of Microsystems Michel, B.;... Short Course... Stuttgart,... 10/1996
The microDAC deformation analysis - a new method for testing and evalu... Michel, B.;... 6th Int. Conf. On... Aachen,... 05/2001
Thermal Stresses in Electronic Packages and Chipcards Michel, B.;... 2nd International... Rochester,... 06/1997
Thermo-Mechanical Reliability of Microelectronic Components Michel, B.;... 3rd Euromech Solid... Stockholm,... 08/1997
Thermomechanische Verträglichkeitsanalysen (TMV) an Komponenten und Sy... Michel, B.;... 9. Workshop AK... Schwieberdin... 10/2000
Thermische und thermomechanische Voroptimierung mittels Finite Elemen... Michel, B. Workshop Thermal... Hanau 03/2010
Testing and Reliability Issues in Nanomechanics Michel, B. Viennano 09, 3rd.... Vienna,... 03/2009
Three-Dimensional Deformation Analysis of MEMS/NEMS by means of x-Ray... Hammacher,... Microtech/Nanotech... Boston, USA 06/2011
Thermo-mechanical Reliability Analysis on Solder Joints of Ceramic Com... Dudek,R.,... 3rd. International... Barcelona,... 06/2005
Towards a Robust Design of Electronics Assemblies under Fracture, Dela... Auersperg,J.;... 9th.Electronic... Singapur 12/2007

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