Lectures

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151 to 200 out of 213 records«« « 1-50 51-100 101-150 151-200 201-213 » »»
Title Author(s) Event Location Date
Zuverlässigkeitsbewertung von Packagingaufbauten mittels microDAC- und... Michel, B. IMAPS-Konf., München München,... 10/2002
Micro- and Nanomechanical Testing and Reliability Concepts für MEMS Michel, B.;... Materials Week, München München,... 10/2002
Micro Materials Center Berlin - materials Research for MEMS Packaging Michel, B.;... Materials Week, München München,... 10/2001
Zuverlässigkeitsbewertung von mikroelektronischen Aufbauten unter Nutz... Michel, B. 25. Deutsche... München,... 10/1998
Mikrosystemtechnik - Anwendung und Perspektiven Michel, B. Vortrag im Kolloquium,... München,... 06/1995
Mechanische und thermische Simulation in der Aufbau- und Verbindungste... Wittler, O.;... SMT/Hybrid/Packaging Nürnberg 05/2011
Testing at Micro and Nanoscale Michel,B. Invited Paper,... Nürnberg 05/2005
Zuverlässigkeit von Mikro bis Nano- Moderne Messtechniken und Simulati... Michel,B. Tutorial,... Nürnberg 06/2004
Reliability Issues of Nanomaterials in Automotive and MEMS Application... Michel,B. Austrian/German/French... Paris 10/2004
Reliability Analysis for Smart Systems on the Way from Micro to Nano Michel, B. Conference Smart... Paris,... 03/2007
MicroDAC and NanoDAC- New Experimental Testing Techniques for High-Tem... Michel,B. High Temperature... Paris,... 09/2005
Reliability Research in the Micro-Nano Region at the Fraunhofer MicroM... Michel,B. Meeting of EURELNET... Paris,... 01/1970
Die Rolle der Mechanik für die Mikrosystemtechnik - Trends, Perspektiv... Michel, B. Symp. 'Mechanik der... Pfäffikon,... 11/2002
Micro Structures- Security and Reliability issues Michel, B.;... Nato Advanced Research... Portoroz,... 10/2008
Crack Avoidance and Crack Evaluation in Mikrosystems Michel, B. Int. Conf. Mikrosystem... Postdam,... 12/1998
Security Assistance Systems- Security Support by Integration of Sensor... Michel,B. Conference on Safety &... Potsdam 11/2006
Security Assistance Systems- Security Support by Integration of Sensor... Michel,B.;Winkl... Safety and Security... Potsdam 11/2006
Microreliability, Nanoreliability-Reliability Issues for MEMS Michel.B. 1st. Int. Forum on... Potsdam 12/2003
Simulation and Reliability on the Way from Micro to Nano Michel,B.,... 21st. CAD-FEM Users... Potsdam,... 11/2003
Thermo-mechanical Reliability of Chip Size Packages Michel, B.;... Conference Microsystem... Potsdam,... 09/1996
Thermal Stresses in Electronic Packages and Chipcards Michel, B.;... 2nd International... Rochester,... 06/1997
Local Deformation Analysis to Improve Reliability Assessment of Materi... Michel,B.,... 11th. Annual SPIE... San Diego,... 02/2006
micro Materials Center Berlin, Reliability Research for MEMS Michel, B.;... Int. Symp. SPIE, Conf.... San Diego,... 03/2002
MicroDAC and nanoDAC - Powerful Techniques for Nondestructiv Microcrac... Michel, B.;... Int. Symp. SPIE, Conf.... San Diego,... 03/2002
Micro Materials Center Berlin - Reliability Research for MEMS Michel, B.;... SPIE Conf.... San Diego,... 03/2002
MicroDAC and NanoDAC- poweful techniques for nodestructive microcrack ... Michel,B.,... Int. Conf. SPIE,... San Diego,... 02/2002
Packaging Reliability on the Way from Micro to Nano Michel, B.,... Invited Plenary... San... 11/2005
Nanoreliability for Mechanically Loaded Devices Vogel,D.,... International Congress... San... 11/2005
Probleme der Zuverlässigkeit in der Elektronik Michel,B. 9.... Schloss... 09/2004
Thermomechanische Verträglichkeitsanalysen (TMV) an Komponenten und Sy... Michel, B.;... 9. Workshop AK... Schwieberdin... 10/2000
Experimental Testing and Reliability Analysis of Electronic Packaging Walter,H.;... SMT China Shanghai,... 09/2007
Numerical Characterization of Electronic Packaging Solutions based on ... Sommer,J.-P.,... 6th. Internat. Conf.... Shenzen,... 08/2005
Micro-Nano-Systems, Applications and State of the Art Michel,B.;... 5th. Int. Conf. New... Sibiu,... 09/2007
Experimental Mechanics on the Way from Micro to Nano, invited plenary ... Michel,B. Internat. Conference... Singapore 11/2004
Towards a Robust Design of Electronics Assemblies under Fracture, Dela... Auersperg,J.;... 9th.Electronic... Singapur 12/2007
Combination of Finite Element Simulation with Micro Deformation Measur... Michel, B.;... Conf. MICROSIM '95 Southampton,... 10/1995
Evaluation of Microcracks in Microelectronic Components Michel, B.;... 15. European Conferenz... Stockholm 08/2004
Thermo-Mechanical Reliability of Microelectronic Components Michel, B.;... 3rd Euromech Solid... Stockholm,... 08/1997
Reliability in the Micro-Nano-Region, Concepts, Trends and Application... N/A MiNAT 2007 Stuttgart 06/2007
Test, Characterization and Reliability of Microsystems Michel, B.;... Short Course... Stuttgart,... 10/1996
Fracture Electronics - Application of Fracture Mechanics to Microelect... Michel, B.;... 9th International... Sydney,... 04/1997
Reliability in Microsystems Michel, B.;... Baltic Electronics... Tallinn,... 10/1996
Die Clearingstelle Automobilelektronik Michel,B. AK Steuern und Regeln... Technologies... 03/2006
Werkstoffmechanik- Zuverlässigkeit, Test und Designmethoden im Mikro- ... Michel,B.,... Symposium 10 Jahre... Teltow 09/2003
Numerical Analysis for Thermo-Mechanical Reliability of Polymeric Appl... Dudek,R.;Walter... Polytronics 2007 Conf. Tokyo, Japan 01/2007
Mechanical Reliability of Microcomponents Michel, B. Advanced Technology... Tokyo, Japan 02/1999
Mechanical Reliability of Microcomponents Michel, B. Presentation of... Tokyo, Japan 02/1999
Automotive Electronics and Related Nanoreliability Electronics Michel,B.;... 1. Intern. Congress... Torino 06/2010
Crack and delamination Risk Evaluation of thin Silicon Based Microelec... Auersperg,J.,... 11th. Internat. Conf.... Torino,... 03/2005
Fracture and Fatigue Behaviour of MEMS-Related Micromaterials Walter,H.,... 11.International... Torino,... 03/2005
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