Lectures

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Title Author(s) Event Location Date
From Microreliability to Nanoreliability-Testing Concepts and Simulati... Michel,B. 1. Internat. Conf. on... Berlin,... 05/2003
From Microelectronics to Nanoelectronics- Reliability and Packaging Is... Michel,B.;Reich... SEMI, Nanoelectronics... Munich 04/2006
Fracture toughness measurements for interaces in microelectronic packa... Maus, I.;... MSE-Materials and... Darmstadt 09/2012
Fracture Mechanics- A Key to Micro- and Nanotechnology Reliability Ana... Michel, B. Karl Wieghardt &... Vienna,... 03/2007
Fracture Mechanics Characterization of Micro-and Nanofilled Polymers b... Vogel,D.,Keller... World Congress... Munich 01/1970
Fracture Mechanical Test Methods for Interface Crack Evaluation of El... Keller,J.;... Microtech/Nanotech... Boston, USA 06/2011
Fracture Mechanical Characterization of Microcracks by Application of ... Keller,J.,... 5th. European Symp. on... Hueckelhofen 09/2004
Fracture mechanical characterization of micro-and nanofilled polymers ... Wunderle,B.,... 4th. IEEE Conference... Munich 08/2004
Fracture elektronics and thermomechanical compatibility (TMC) of micro... Michel, B. 3rd Int. Conf.... Berlin,... 04/2000
Fracture Electronics - Fracture Analysis of Microelectronic Components Michel, B.;... 11th European... Futuroscope,... 09/1996
Fracture Electronics - Application of Fracture Mechanics to Microelect... Michel, B.;... 9th International... Sydney,... 04/1997
Fracture and Fatigue Behaviour of MEMS-Related Micromaterials Walter,H.,... 11.International... Torino,... 03/2005
FIBDAC-ein leistungsfähiges Messverfahren zur ermittlung von lokalen E... Michek,B. ITG Conferenz... Grainau 01/1970
FIBDAC- ein leistungsfähiges Messverfahren zur Ermittlung von lokalen ... Michel,B. 24. ITG Tagung... Grainau 05/2006
FibDAC Stress Relief - a Novel Stress Measurement Approach for Semicon... Vogel, D;... Microtech/Nanotech... Anaheim, USA 10/2010
Fatigue Crack Evaluation in Electronics Michel, B.;... 12th International... Miskolc 03/1994

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