FibDAC Stress Relief - a Novel Stress Measurement Approach for Semiconductor BEoL Structures  

Internal ID	183
Author(s)	Vogel, D; Gollhardt, A.; Keller, J.; Michel, B.
Event	Microtech/Nanotech Congess, Workshop Micro- and Nanoreliability
Location	Anaheim, USA
Date	21.10.2010
End date	24.10.2010