The microDAC deformation analysis - a new method for testing and evaluation of solder interconnect reliability

Internal ID	1
Author(s)	Michel, B.; Dudek, R.; Vogel, D.
Event	6th Int. Conf. On brazing, High Temperature Brazing and diffusion Bonding
Location	Aachen, Germany
Date	08.05.2001
End date	10.05.2001