Fracture toughness measurements for interaces in microelectronic packages on samples from production

Internal ID	204
Author(s)	Maus, I.; Pape, H.; Nabi, M.; Goroll, M.; Keller, J.; Michel, B.
Event	MSE-Materials and Engineering Congress, Symposium D, Reliability
Location	Darmstadt
Date	25.09.2012
End date	27.09.2012