Fracture Mechanical Test Methods for Interface Crack Evaluation of Electronic Packages

Internal ID	187
Author(s)	Keller,J.; Maus, I; Schlottig, G.; Pape,H.; Wunderle, B.; Michel, B.;
Event	Microtech/Nanotech 2011, Symposium Micro- and Nanoreliability
Location	Boston, USA
Date	13.06.2011
End date	16.06.2011