Lifetime Prediction for Advanced Packaging based on Physics of Failure Approaches on a Micro and Nanoscale

Internal ID	128
Author(s)	Wunderle,B., Dudek,R., Vogel,D., Michel,B.
Event	Int. Symp. on Advanced Packaging Materials (APM 2006)
Location	Atlanta, USA
Date	15.03.2006
End date	17.03.2006