Nonlinear Copper Behaviour of TSV and the Cracking Risk during BEoL Built-up for 3D-IC-Integration

Internal ID	196
Author(s)	Auersperg,J.;Vogel,D.;Auerswald,E.;Rzepka,S.;Michel,B.
Event	EuroSimE 2012, Internat. Conference
Location	Lissabon, Portugal
Date	16.04.2012
End date	18.04.2012