Stress Chip Measurements of Internal Package Stresses for Process Characterization and Health Monitoring

Internal ID	195
Author(s)	Schindler-Saefkow,F.;Rost,F.;Faust,W.;Rzepka,S.;Wunderle,B.;Michel,B.
Event	EuroSimE 2012, Internat.Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems
Location	Lissabon, Portugal
Date	16.04.2012
End date	18.04.2012