Thermo-mechanical Reliability Analysis on Solder Joints of Ceramic Components

Internal ID	101
Author(s)	Dudek,R., Doering,R., Michel,B., Picault,A., Autissier, J.-F.
Event	3rd. International Conf. on Lead-free Electronics
Location	Barcelona, Spain
Date	08.06.2005
End date	09.06.2005