Lifetime Prediction for Advanced Packaging based on Physics of Failure Approaches on a Micro and Nanoscale

Internal ID 128
Author(s) Wunderle,B., Dudek,R., Vogel,D., Michel,B.
Event Int. Symp. on Advanced Packaging Materials (APM 2006)
Location Atlanta, USA
Date 15.03.2006
End date 17.03.2006