Thermo-Mechanical Reliability of 3D-Integrated Microstructures in Stacked Silicon

Internal ID	137
Author(s)	Wunderle,B.;Kaulfersch,E; Ramm,P.;Michel,B.;Reichl,H.
Event	MRS Annual Conference
Location	Boston, USA
Date	27.11.2006
End date	30.11.2006