Capabilities of Incorporating Bulk Fracture, Bimaterial Interface and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applications

Internal ID 167
Author(s) Auersperg, J.; Michel, B.
Event 7th. Internat. Conf. on Electronic Packaging Technology (Best paper award)
Location ICEPT 2006, Shanghai, China
Date 27.08.2006
End date 27.08.2006