Fields of expertise

Thermomechanical Reliability Analysis of Microcomponents in 'high tech' Systems
Fracture Mechanics, Crack and Fracture Analysis in Microsystems and Microelectronic Components ("Fracture Electronics")
Development of New Tools for Microdeformation Analysis Based upon Grey Value Image Correlation Techniques (microDAC)
Combined Numerical and Experimental Approach
Finite Element Simulation for Micro Materials Applications
Laser Measurement Techniques Applied to Small Dimensions
Nanomechanics and Micro Mechatronics Modelling
Coupled Field Problems (mechanical, electro-magnetic, optical, diffusion and "combined" field effects)
Modular Microsystems and MEMS Reliability Life Time Evaluations.

Principal Accomplishments

Systematized knowledge in the field of physics and micromechanics of crack and fracture phenomena, theoretical damage, failure and fracture concepts and their experimental verification
Carried out fundamental work with his research group in the field of thermo-mechanical behaviour of microcomponents and microsystems
Carried out a lot of studies, expertises and research reports for companies and contractors all over the world in the field of mechanical reliability of microcomponents in various applications (e.g. automotive, IT, space research etc.)
Derived concepts in the field of combined theoretical and experimental approach to life-time prediction and failure prevention of microcomponents, e.g. in the field of materials mechanics of electronic packaging
Organized successful international, European and German conferences, meetings and workshops in different fields of materials science, mechanics and physics of crack and fracture, and
published many papers in reviewed journals, books, reports.

Member of Program Committees (selected)

IMAPS Poland, Gdansk 2010, 2011
Poly’99 Internat Conference, IEEE-CPMT, Paris 1999	General Chair
Poly ‘2000, Internat. Conference, IEEE-CPMT, London , 2000	General Co-Chair
ESTC 2006, Electronic System Technology Conference, Dresden 2006
ESTC 2008, Electronic System Technology Conference, London 2008
ESTC 2010, Electronic System Technology Conference, Berlin 2010
1st Int. Conference Micro Nao Reliability, Berlin 2007, Germany	General Chair
SPIE Conf. Non-Destructive Testing, San Diego 2006	Co-Chair, Conf. Co-Chair
EuroSimE, Conference Series,Paris 2011, Berlin, Delft etc.
Conf. Design, Microfabrication and Packaging, Cannes, France,2006	Conf. Chair
DTIP Conference Series, Cannes, Grenoble etc.
Polytronics, Stockholm, Wroclaw, Tokyo, Conf. Series
Micro Materials Conferences, Berlin 1997,2000
Micro Car Conferences, LEIPZIG 2006,2008, 2011
Workshop Series Micro& Nanoreliability, Nanotech, Boston	Chairman
Baltic Electronic Conferences, Conf. Series, Tallinn, Estonia
Safety and Security Conference, Potsdam 2009	Program Chair
Future Security Research Conference Series, Berlin, Karlsruhe
Microfactory Conference Tokyo, Japan
European Conference on Fracture, Andreanopoulis, Greece, 2006
International Conference on Fracture Torino, Italy, 2006
Smart Systems Integration, Brussels, Como, Barcelona, Zurich etc.
SMT, Hybrid Nürnberg, Conference Series, Germany
Microsystem Technologies, Berlin, Düsseldorf etc., Conf. Series
EPTC, Conference Series, Singaapore
European Packaging Conferences (EUPACK)
Semiconductor Cenference Dresden SCD 2011
SIMTEC 2012, Montecatini, Italy
Chemnitzer Fachtagungen Mikroelektronik, conf. Series
Leibniz Conferences Nanoscience, Lichtenwalde, Conf. Series
3^rd.Leibniz Conference Nanoscience, Lichtenwalde 2007	General Chair
ECEPT Shanghai, Conf. Series
GMM Workshop Series Micro-Nano-Integration,Stuttgart 2010
China Solid State Lighting Conference Series, 2010, 2011
Micro-Nano Optoelectronic Systems Conf. Bremen 2011
Conference IMAPS EMPC Brighton UK, 2011
HITEN- High Temperature Electronics Conf. Series, Oxford, Paris
Conference Series Reliability and Design, Hamburg 2011
Adhesives in Electronics, Stockholm,2002