| Zuverlässigkeitsbewertung- Bauteiloptimierung durch Verbindung von Simulati... |
Michel, B. |
SNo 3-2010 SMT Hybrid... |
2010 |
3 |
| Microsecurity- Sicherheit durch Mikro- und Nanotechnologien |
Michel, B. |
Proc. Silicon Saxony Day 2009 |
2009 |
10 |
| Testing and Reliability Issues in Nanomechanics |
Michel, B. |
Proc. 3rd. Vienna Int.... |
2009 |
150-151 |
| What is MMC?- The MicroMaterials Center Berlin and Chemnitz |
Michel, B. |
in: Micromaterials and... |
2009 |
8-11 |
| EUCEMAN- The European Center for Microreliability and Nanoreliability |
Michel, B. |
MST News Berlin No 4/08 |
2008 |
41 |
| EUCEMAN- The European Center for Microreliability and Nanoreliability |
Michel, B. |
MST News Berlin No 4/08 |
2008 |
41 |
| Nanoreliability- Reliability Research for Microsystem Technology on the Way... |
Michel, B. |
MST News Berlin no 4/08 |
2008 |
28 |
| NanoDAC- a New Technique for Nano-Deformation and Nano-Reliability Analysis |
Michel, B. |
MST News, VDI/VDE-IT 2006,... |
2006 |
37 |
| Experimental Mechanics on the Way from Micro to Nano |
Michel, B. |
Experimental Technique, vol.... |
2005 |
3-5 |
| Microreliability and Nanoreliability for MEMS |
Michel, B. |
Knobloch,H.; Kaminorz, Y.... |
2004 |
269-276 |
| Mechanical Property Measurements – Lessons Learned from the Microelectronic... |
Michel, B. |
Int. Conf. on Metallurgical... |
1999 |
93 |
| Fracture Electronics - Concepts of Fracture Mechanics for Reliability |
Michel, B. |
Abstract Volume: Micro... |
1997 |
203 - 204 |
| Eigenspannungen in Verbundwerkstoffen der Mikrosystemtechnik |
Michel, B. |
in: G. Ziegler,... |
1996 |
223 - 224 |
| Werkstoffmechanische Untersuchungen an Lötstellen in mikrotechnischen Aufba... |
Michel, B. |
Tagung Weichlöten in... |
1996 |
223 - 233 |
| Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik |
Michel, B. |
Proc. Tagung... |
1995 |
96 |
| Mechanical Reliability Analysis of Microcomponents |
Michel, B. |
Proc. of the 4th Intern.... |
1994 |
- |
| Über das Wechselverhältnis von Kontinuumsmechanik und Strukturphysik fester... |
Michel, B. |
Fortschritt der Physik... |
1982 |
233 - 310 |
| Advancedd Sensor Technologies for Nondestructive Evaluation and Structural ... |
Meyendorf,N.;Ba... |
Proceedings of SPIE, |
2005 |
224 p. |
| Special Issue DTIP Cannes 2014 |
Megherby,S.;Mic... |
Microsystem Technologies
vol... |
2016 |
1 |
| Verfahren zur feldmässigen Bestimmung von Deformationszuständen in mikrosko... |
Kuehnert,R.,... |
Deutsches Patent Nr. 196 14... |
2004 |
- |
| Nanodeformation Analysis near Small Cracks by means of NanoDAC Technique |
Keller,J.;... |
G. Wilkening and L. Koenders... |
2005 |
481-494 |
| Papers of Micro- and Nanoreliability Symposium, |
Keller,J.;... |
Proc. NSTI Nanotechnology... |
2011 |
1-80 |
| MicroDAC - ein Meßverfahren zur Ermittlung von Werkstoffeigenschaften im Mi... |
Keller, J.;... |
VDI-Berichte Nr. 1829 (2004) |
2004 |
433-440 |
| Computational Assessment of Interconnection Technology for High Power, High... |
Kaulfersch,E.,... |
Proc. Internat. Conf. on High... |
2003 |
79-86 |
| Basic thermo-mechanical property estimation of a 3D- crosslinked
epoxy/SiO... |
Hoelck,O.;Dermi... |
Microelectronics Reliability... |
2011 |
1027-1034 |
| Comparative Characterization of Chip Epoxy Interfaces by Molecular Modeling... |
Hoelck,O.;... |
Microelectronics... |
2012 |
1285-1290 |
| Generalized Mechanical Integral Concept JG and its Application in Microelec... |
Ghavifekr,H.B.,... |
Senors and Actuators A99(2002) |
2002 |
183-187 |
| Generalized Fracture Mechanical Integral Concept JG and its Application in ... |
Ghafvifekr,... |
Sensors and Actuators A 99,... |
2002 |
183-187 |
| Testing, Reliability, and Application of Micro-and Nano-Materials SYstems I... |
Geer,R.E.;Meyen... |
Proceedings of SPIE, vol. 5766 |
2005 |
178 pp. |
| Chances and Limits of Computer Tomography in Materialographic Investigatio... |
Faust,W.;Noack,... |
Practical Metallography
Carl... |
2012 |
328-342 |
| reliability Prediction of Area Array Solder Joints |
Dudek,R.,Doerin... |
Transactions of ASME,Journal... |
2003 |
562-568 |
| Auf Biegen und Brechen- Zuverlässigkeit von Mikro- und Nanosystemen" |
Dual, J.,... |
Bulletin der ETH Zürich, No.... |
2004 |
57-60 |
| Special Issue on Design, Test, Integration and Packaging of MEMS and MOEMS,... |
Courtois, B.;... |
Microsystem Technologies vol.... |
2015 |
11 |
| Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture ... |
Auersperg,J.;... |
Proc. 7th. Int. Conference on... |
2007 |
309 |
| Towards a Robust Design of Electronics Assemblies under Fracture, Delaminat... |
Auersperg, J.;... |
Proc. 9th. Electronic... |
2007 |
59 |
