| Thermo-Mechanical Analysis of Microelectronic Components and Chipcards |
Michel, B.;... |
11th. Int. Conf. On... |
1998 |
965 – 968 |
| Theoretical concepts and experiments in fracture mechanics- macroscopic and... |
Michel, B.;... |
European Journal of Mechanics... |
1992 |
115-133 |
| Thermomechanische Untersuchungen zur Zuverlässigkeitserhöhung von Mikrosyst... |
Michel, B.;... |
Fachtagung Informations- und... |
1998 |
16 – 23 |
| TeSiMat- Inno Profile Junior Research Group- a Short Report |
Winkler, T.;... |
in: Micromaterials and... |
2009 |
134-135 |
| The European Center for MicroNanoReliability- EUCEMAN-
the Powerful Sponso... |
Michel, B.;... |
Micromaterials and... |
2012 |
N/A |
| Testing and Reliability Issues in Nanomechanics |
Michel, B. |
Proc. 3rd. Vienna Int.... |
2009 |
150-151 |
| Towards a Robust Design of Electronics Assemblies under Fracture, Delaminat... |
Auersperg, J.;... |
Proc. 9th. Electronic... |
2007 |
59 |
| Testing, Reliability, and Application of Micro-and Nano-Materials SYstems I... |
Geer,R.E.;Meyen... |
Proceedings of SPIE, vol. 5766 |
2005 |
178 pp. |
| The microDAC method - a powerful means for microdeformation analysis in ele... |
Michel, B.;... |
Symposium on Applications of... |
1997 |
- |
| The microDAC method - a powerful means for microdeformation analysis in ele... |
Michel, B.;... |
Symposium on Applications of... |
1997 |
- |
