| A Tribute to Albert Einstein |
Michel,B.(ed.) |
Micromaterials and... |
2006 |
64 p. |
| Advanced Virtual Testing of Structural Integrity in Microelectronics |
Shirangi,M.H.;M... |
Proceedings MicroCar 2011,... |
2011 |
im Druck |
| Advancedd Sensor Technologies for Nondestructive Evaluation and Structural ... |
Meyendorf,N.;Ba... |
Proceedings of SPIE, |
2005 |
224 p. |
| Aktivitäten zur Zuverlässigkeit von Nanotechnologien |
Michel, B.;... |
Nanotechnologie Aktuell, vol.... |
2014 |
104-107 |
| Application of Fracture Mechanics to Micromechanics and Microsystem Technol... |
Michel, B.;... |
Advances in Fracture Research... |
1994 |
683 - 690 |
| Application of Solid Mechanics in the Fields of Microelectronics and Micro ... |
Michel, B.;... |
2nd European Solid Mechanics... |
1994 |
N9 |
| Auf Biegen und Brechen- Zuverlässigkeit von Mikro- und Nanosystemen" |
Dual, J.,... |
Bulletin der ETH Zürich, No.... |
2004 |
57-60 |
| Basic thermo-mechanical property estimation of a 3D- crosslinked
epoxy/SiO... |
Hoelck,O.;Dermi... |
Microelectronics Reliability... |
2011 |
1027-1034 |
| Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture ... |
Auersperg,J.;... |
Proc. 7th. Int. Conference on... |
2007 |
309 |
| Chances and Limits of Computer Tomography in Materialographic Investigatio... |
Faust,W.;Noack,... |
Practical Metallography
Carl... |
2012 |
328-342 |
| Charakterisierung von Bruchvorgängen in Mikrosystemen mit MicroDAC- und Nan... |
Michel, B.;... |
DVM-AK Bruchvorgänge:... |
2002 |
- |
| Charakterisierung von Werkstoffverbunden für neue Einsatzmöglichkeiten im B... |
Michel, B.;... |
Proc. Werkstoffwoche '96 |
1996 |
- |
| Charakterisierung von Werkstoffverbundunden für neue Einsatzmöglichkeiten i... |
Michel, B.;... |
Proc. Werkstoffwoche '96,... |
1996 |
233 - 239 |
| Comparative Characterization of Chip Epoxy Interfaces by Molecular Modeling... |
Hoelck,O.;... |
Microelectronics... |
2012 |
1285-1290 |
| Computational Assessment of Interconnection Technology for High Power, High... |
Kaulfersch,E.,... |
Proc. Internat. Conf. on High... |
2003 |
79-86 |
| Das MicroDAC-Verfahren - eine Methode zur quantitativen Verformungsbewertun... |
Michel, B.;... |
Proc. 2. Chemnitzer... |
1995 |
31 - 35 |
| Der Einsatz von Mikro- und Nanowerkstoffen – Grundlage für die Miniaturisie... |
Michel, B.;... |
13. Int. Wiss. Konferenz, HTW... |
1998 |
125 – 128 |
| Editorial for invited paper
"RF MEMS:An Enabling Technology for Modern Wir... |
Michel,B. |
Microsystem Technologies voll... |
2015 |
1 |
| Eigenspannungen in Verbundwerkstoffen der Mikrosystemtechnik |
Michel, B. |
in: G. Ziegler,... |
1996 |
223 - 224 |
| Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik |
Michel, B. |
Proc. Tagung... |
1995 |
96 |
| Erhöhung der Zuverlässigkeit von Mikro- und Nanokomponenten und Systemen du... |
Michel,... |
Microelectronic Packaging in... |
2014 |
309-312 |
| EUCEMAN- The European Center for MicroNanoReliability Research in Europe |
Michel, B.;... |
Smart Systems Integration for... |
2014 |
703-708 |
| EUCEMAN- The European Center for Microreliability and Nanoreliability |
Michel, B. |
MST News Berlin No 4/08 |
2008 |
41 |
| EUCEMAN- The European Center for Microreliability and Nanoreliability |
Michel, B. |
MST News Berlin No 4/08 |
2008 |
41 |
| EUCEMAN- The European Center for Microreliability and Nanoreliability |
Michel,B.;... |
Micromaterials &... |
2007 |
92-93 |
| EUCEMAN- The European Center on Micro-Nano-Reliability |
Michel, B.;... |
Publication of LIFIS, Leibniz... |
2012 |
1-5 |
| Evaluation microdefected structures by AFM-based deformation measurement |
Vogel,D.,... |
Proc. SPIE, vol. 5045, ed.... |
2003 |
1-12 |
| Evaluation of Microdeformations and Fracture Quantities by Means of Micro M... |
Michel, B.;... |
Proc. 10th Intern. Conf.... |
1994 |
39 - 44 |
| Experimental and Numerical Deformation Analysis on Components of Microsyste... |
Michel, B.;... |
Proc. 1st European Conf. on... |
1994 |
122 - 124 |
| Experimental and Numerical Investigations of Thermomechanically Stressed Mi... |
Michel, B.;... |
Micro System Technologies 1 |
1994 |
14 - 22 |
| Experimental Mechanics on the Way from Micro to Nano |
Michel, B. |
Experimental Technique, vol.... |
2005 |
3-5 |
| Experimentelle und numerische Deformationsanalyse an Komponenten der Mikros... |
Michel, B.;... |
Deutscher Verband für... |
1994 |
122 - 125 |
| FIBDAC StressRelief - a New Method to Access Stress on Patterned Si Wafer |
Vogel,D.;Gollha... |
Proceedings MicroCar 2011,... |
2011 |
in print |
| Fracture Electronics - Bruchmechanik angewendet auf Chipkarten, Leiterplatt... |
Michel, B.;... |
Proc. 28. Jahrestagung des AK... |
1996 |
10 |
| Fracture Electronics - Concepts of Fracture Mechanics for Reliability |
Michel, B. |
Abstract Volume: Micro... |
1997 |
203 - 204 |
| Fracture Electronics - Fracture problems in electronic packaging |
Michel, B.;... |
European Conference on... |
1996 |
106 - 107 |
| Generalized Fracture Mechanical Integral Concept JG and its Application in ... |
Ghafvifekr,... |
Sensors and Actuators A 99,... |
2002 |
183-187 |
| Generalized Mechanical Integral Concept JG and its Application in Microelec... |
Ghavifekr,H.B.,... |
Senors and Actuators A99(2002) |
2002 |
183-187 |
| German Association of Nanotechnology: Objectives and Benefits |
Nonninger, R.;... |
Smart Systems Integration for... |
2014 |
353-357 |
| Image Correlation Techniques for Microsaytem Inspection |
Vogel, D.;... |
in: Optical Inspection of... |
2006 |
55-102 |
| Improvement of the Thermo-Mechanical Performance of Advanced Packages by Ex... |
Michel, B.;... |
Workshop Mechanical... |
1998 |
87 – 94 |
| Mechanical Properties of Microsystem Components |
Michel, B.;... |
SPIE 43rd Annual Meeting;... |
1998 |
- |
| Mechanical Property Measurements – Lessons Learned from the Microelectronic... |
Michel, B. |
Int. Conf. on Metallurgical... |
1999 |
93 |
| Mechanical Reliability Analysis of Microcomponents |
Michel, B. |
Proc. of the 4th Intern.... |
1994 |
- |
| Mechanical Reliability of Chipcards |
Michel, B.;... |
12. Int. Mittweidaer... |
1996 |
51 - 59 |
| Mechanical reliability of micro-components in electronics and microsystem t... |
Michel, B.;... |
Technology, Law and Insurance... |
1996 |
29 - 35 |
| Mechanische und thermische Simulation in der Aufbau- und Verbindungstechnik |
Wittler, O.;... |
Systemintegration in der... |
2011 |
57-64 |
| Mechanische und thermische Zuverlässigkeit von Komponenten und Bauteilen de... |
Michel, B.;... |
Proc. Microengineering,... |
1994 |
35 |
| Mechanische Zuverlässigkeit von Werkstoffverbunden in der Mikrosystemtechni... |
Michel, B.;... |
Werkstoffwoche `98, München,... |
1998 |
- |
| Mechanism of Moisture Diffusion, Hygroscopic Swelling and Adhesion Degradat... |
Shirangi ,... |
Moisture Sensitivity of... |
2010 |
29-69 |
