Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics

Interne ID	92
Autor(en)	Auersperg,J.; Michel, B.
Wo veröffentlicht?	Proc. 7th. Int. Conference on Electronic Packaging Technology, China August 2006
Jahr	2007
Seite(n)	309