Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique
Interne ID
85
Autor(en)
Michel,B.; Keller, J.
Wo veröffentlicht?
in:E.Suhir,Y.C. Lee, C.P. Wong (eds.) : Micro- and Opto-Electronic Materials and Structures, vol .2; Springwer Science and Business Media Inc.-, New York