Mechanism of Moisture Diffusion, Hygroscopic Swelling and Adhesion Degradation in Epoxy Molding Compounds

Interne ID	107
Autor(en)	Shirangi , M.H.;Michel, B.
Wo veröffentlicht?	Moisture Sensitivity of Plastic Packages of IC Devices, ed. X.J.Fan, E. Suhir, Springer Series on Micro- and Optoelectronic Materials, Heidelberg, New York
Jahr	2010
Seite(n)	29-69