| Interne ID | 36 |
|---|---|
| Autor(en) | Michel, B.; Vogel, D.; Schubert, A.; Auersperg, J.; Reichl, H. |
| Wo veröffentlicht? | Symposium on Applications of Experimental Mechanics to Electronic Packaging at the 1997 ASME In. Mechanical Engineering Congress and Exposition, Nov. 1997, Dallas, Proc., AMD-Vol. 226, EEP-Vol. 22 |
| Jahr | 1997 |
| Seite(n) | - |