Fachgebiete

  • Thermomechanische Zuverlässigkeit von Mikrokomponenten in "high tech" Systemen
  • Mikromechanik und Nanomechanik
  • Entwicklung neuer Tools für die Mikro- und Nanoverformungsanalyse (microDAC, nanoDAC)
  • Kombination von Simulation und experimentellen Untersuchungen
  • Finite Elemente Simulation für Anwendungen in Mikrosystemtechnik und Nanotechnologie
  • Lasermesstechniken, Röntgenografische Spannungsanalyse, Akustomikroskopie
  • Modelle für Nanomechanik und Mikromechatronik
  • Gekoppelte Feldprobleme (mechanisch, thermisch, elektrisch, Diffusion etc.)
  • Lebensdauerbewertung für Mikrobauteile (MEMS)
  • Mikrotechnik für Automobilanwendungen (Sensorik usw.)

    

Mitglied von Programm-Commites (ausgewählt)

IMAPS Poland, Gdansk 2010, 2011
Poly’99 Internat Conference, IEEE-CPMT, Paris 1999General Chair
Poly ‘2000, Internat. Conference, IEEE-CPMT, London , 2000General Co-Chair

ESTC 2006, Electronic System Technology Conference, Dresden 2006

ESTC 2008, Electronic System Technology Conference, London 2008

ESTC 2010, Electronic System Technology Conference, Berlin 2010

1st Int. Conference Micro Nao Reliability, Berlin 2007, GermanyGeneral Chair
SPIE Conf. Non-Destructive Testing, San Diego 2006Co-Chair, Conf. Co-Chair

EuroSimE, Conference Series,Paris 2011,  Berlin, Delft etc.

Conf. Design, Microfabrication and Packaging, Cannes, France,2006Conf. Chair

DTIP Conference Series, Cannes, Grenoble etc.

Polytronics, Stockholm, Wroclaw, Tokyo, Conf. Series

Micro Materials Conferences, Berlin 1997,2000
Micro Car Conferences, LEIPZIG 2006,2008, 2011
Workshop Series Micro& Nanoreliability, Nanotech, Boston      Chairman

Baltic Electronic Conferences, Conf. Series, Tallinn, Estonia

Safety and Security Conference, Potsdam 2009Program Chair

Future Security  Research Conference Series, Berlin,  Karlsruhe

Microfactory Conference Tokyo, Japan

European Conference on Fracture, Andreanopoulis, Greece, 2006

International Conference on Fracture Torino, Italy, 2006

Smart Systems Integration, Brussels, Como, Barcelona, Zurich etc.

SMT, Hybrid Nürnberg, Conference Series, Germany

Microsystem Technologies, Berlin, Düsseldorf etc., Conf. Series

EPTC, Conference Series, Singaapore

European Packaging Conferences (EUPACK)

Semiconductor Cenference Dresden SCD 2011

SIMTEC 2012, Montecatini, Italy

Chemnitzer Fachtagungen Mikroelektronik, conf. Series

Leibniz Conferences Nanoscience, Lichtenwalde, Conf. Series

3rd.Leibniz Conference Nanoscience, Lichtenwalde 2007General Chair

ECEPT Shanghai, Conf. Series

GMM Workshop Series  Micro-Nano-Integration,Stuttgart 2010

China Solid State Lighting Conference Series, 2010, 2011

Micro-Nano Optoelectronic Systems Conf. Bremen 2011

Conference IMAPS EMPC Brighton UK, 2011

HITEN- High Temperature Electronics Conf. Series, Oxford, Paris

Conference Series Reliability and Design, Hamburg 2011

Adhesives in Electronics, Stockholm,2002