| A new Approach to Measure Local Residual Stresses |
Vogel,D.,... |
N/A |
Dresden |
01/1970 |
| A new Method for Local Stress Field Analysis near Cracks in Micro- and... |
Michel,B.,... |
16. European... |
Alexandroupo... |
06/2006 |
| Accelerated Failure Test for High- T Applications of Power Mosfet by P... |
Schacht,R.,... |
International Workshop... |
Belgirate,... |
09/2005 |
| Advances in Micro-and Nanotechnologies- reliability Issues, Testing an... |
Michel,B. |
Lecture, University of... |
Belgrade,... |
12/2004 |
| Aktivitäten zur lokalen Deformationsanalyse für Mikro- und Nanokompone... |
Michel, B.;... |
DVM AK Treffen... |
Geesthacht,... |
10/2008 |
| Anforderungen aus der Nanotechnologie an die Zuverlässigkeitskonzepte ... |
Michel,B.,... |
1.DVM Konferenz... |
Darmstadt |
03/2006 |
| Anforderungen, Möglichkeiten, Trends von Nano- und Mikrotechniken |
Michel,B. |
Kooperationsforum... |
München |
03/2007 |
| Application of Fracture Mechanics for the Reliability Analysis of Asse... |
Shirangi, H.,... |
Conference Micro Car... |
Leipzig |
02/2013 |
| Application of Fracture Mechanics to Microsystem Technology |
Michel, B.;... |
VIII International... |
Kiev, Russia |
06/1993 |
| Aspects of Chip Package Interaction and 3D Integration Assessed by the... |
Auersperg, J.;... |
2011 IEEE... |
Dresden |
05/2011 |
| Automotive Electronics and Related Nanoreliability Electronics |
Michel,B.;... |
1. Intern. Congress... |
Torino |
06/2010 |
