| Mechanical Reliability of Microcomponents |
Michel, B. |
Advanced Technology... |
Tokyo, Japan |
02/1999 |
| Towards a Robust Design of Electronics Assemblies under Fracture, Dela... |
Auersperg,J.;... |
9th.Electronic... |
Singapur |
12/2007 |
| Fracture Electronics - Application of Fracture Mechanics to Microelect... |
Michel, B.;... |
9th International... |
Sydney,... |
04/1997 |
| Thermomechanische Verträglichkeitsanalysen (TMV) an Komponenten und Sy... |
Michel, B.;... |
9. Workshop AK... |
Schwieberdin... |
10/2000 |
| Probleme der Zuverlässigkeit in der Elektronik |
Michel,B. |
9.... |
Schloss... |
09/2004 |
| Capabilities of Incorporating Bulk Fracture, Bimaterial Interface and ... |
Auersperg, J.;... |
7th. Internat. Conf.... |
ICEPT 2006,... |
08/2006 |
| Mikroelektronik und Mikrosystemtechnik - Anwendungenvon Mikro- und Nan... |
Michel, B. |
7. Sächsische... |
Leipzig,... |
06/2003 |
| Numerical Characterization of Electronic Packaging Solutions based on ... |
Sommer,J.-P.,... |
6th. Internat. Conf.... |
Shenzen,... |
08/2005 |
| The microDAC deformation analysis - a new method for testing and evalu... |
Michel, B.;... |
6th Int. Conf. On... |
Aachen,... |
05/2001 |
| Micro-Nano-Systems, Applications and State of the Art |
Michel,B.;... |
5th. Int. Conf. New... |
Sibiu,... |
09/2007 |
| Fracture Mechanical Characterization of Microcracks by Application of ... |
Keller,J.,... |
5th. European Symp. on... |
Hueckelhofen |
09/2004 |
| Thermomechanical Behaviour of Chipcard Materials |
Michel, B.;... |
5th European... |
Maastricht,... |
04/1997 |
| Nanoreliability- Lifetime Estimation for nanotechnology Applications B... |
Michel, B. |
4th. Int. Symposium... |
Dresden |
11/2005 |
| Fracture mechanical characterization of micro-and nanofilled polymers ... |
Wunderle,B.,... |
4th. IEEE Conference... |
Munich |
08/2004 |
| NanoDAC - a new experimental method for reliability analysis in advanc... |
Michel, B.;... |
4th Int. Workshop Area... |
Berlin,... |
04/2002 |
| Characterization approaches of nanoscale modified plastics |
Vogel,D.,... |
4th IEEE Conference on... |
Munich |
08/2004 |
| Werkstoffeinsatz und Zuverlässigkeit von Mikrosystemen |
Michel, B. |
43. Int. Wiss.... |
Ilmenau,... |
09/1998 |
| Zuverlässigkeit von Sensorsystemen und deren Komponenten |
Michel, B. |
3rd. Leibniz... |
Lichtenwalde |
10/2006 |
| Microsecurity,Nanosecurity-Security Research in Europe Utilizing Advan... |
Michel,B.;... |
3rd. Leibniz... |
Lichtenwalde |
11/2007 |
| Thermo-mechanical Reliability Analysis on Solder Joints of Ceramic Com... |
Dudek,R.,... |
3rd. International... |
Barcelona,... |
06/2005 |
| Reliability of Electronics in Aviation |
Michel,B.;Kaulf... |
3rd. Dresden Airport... |
Dresden |
12/2007 |
| Nanoreliability- Zuverlässigkeitskonzepte für den Mikro-Nano-Übergangs... |
Michel,B.;... |
3rd Leibniz Conference... |
Lichtenwalde |
11/2007 |
| Fracture elektronics and thermomechanical compatibility (TMC) of micro... |
Michel, B. |
3rd Int. Conf.... |
Berlin,... |
04/2000 |
| Thermo-Mechanical Reliability of Microelectronic Components |
Michel, B.;... |
3rd Euromech Solid... |
Stockholm,... |
08/1997 |
| Die Möglichkeiten der FIB-Technik zur Schadensanalyse an bleifreien Lo... |
Faust,W.,... |
39.... |
Erlangen |
09/2005 |
| Microreliability,Nanoreliability-Zuverlässigkeitsbewertung von Mikro- ... |
Michel,B. |
37. Tagung des... |
Hamburg |
02/2005 |
| Interface-Risse in Komponenten der Mikro- und Nanoelektronik |
Michel,B.;... |
36. Tagung des DVM... |
Aachen |
02/2006 |
| Microsecurity and Nanosecurity- Security Research Using the Advantages... |
Michel,B.;... |
2nd. European Conf.... |
Barcelona,... |
04/2008 |
| Thermal Stresses in Electronic Packages and Chipcards |
Michel, B.;... |
2nd International... |
Rochester,... |
06/1997 |
| Zuverlässigkeitsbewertung von mikroelektronischen Aufbauten unter Nutz... |
Michel, B. |
25. Deutsche... |
München,... |
10/1998 |
| Physics of Failure-basierte Lebensdauervorhersage im Mikro-Nano-Überga... |
Wunderle,B.,... |
24. Tagung... |
Grainau,... |
05/2006 |
| FIBDAC- ein leistungsfähiges Messverfahren zur Ermittlung von lokalen ... |
Michel,B. |
24. ITG Tagung... |
Grainau |
05/2006 |
| Möglichkeiten der Bruchmechanik für die Schadensvermeidung in den Bere... |
Michel, B.;... |
22. Wiss. Konferenz... |
Mittweida |
10/2012 |
| Möglichkeiten der Bruchmechanik für die Schadensvermeidung in den Bere... |
Michel, B.;... |
22. Internat.Wiss.... |
Mittweida |
10/2012 |
| Simulation and Reliability on the Way from Micro to Nano |
Michel,B.,... |
21st. CAD-FEM Users... |
Potsdam,... |
11/2003 |
| Zuverlässigkeit kleinster Strukturen in der industriellen Anwendung |
Michel, B. |
21. Ulmer Gespräch,... |
Ulm, Germany |
04/1999 |
| Zuverlässigkeit kleinster Strukturen in der industriellen Anwendung |
Michel, B. |
21. Ulmer Gespräch,... |
Ulm, Germany |
04/1999 |
| Aspects of Chip Package Interaction and 3D Integration Assessed by the... |
Auersperg, J.;... |
2011 IEEE... |
Dresden |
05/2011 |
| Simulation of Crack Mechanisms in Materials |
Michel,B. |
2.Int. Conference... |
Berlin |
11/1991 |
| MicroNanoReliability 2007 |
Michel,B.(ed.) |
1st. World Congress on... |
Berlin |
09/2007 |
| Microreliability, Nanoreliability-Reliability Issues for MEMS |
Michel.B. |
1st. Int. Forum on... |
Potsdam |
12/2003 |
| Packaging of Microsystems |
Michel, B.;... |
1st French-UK Workshop... |
Wyboston... |
01/2003 |
| Reliability and Safety Estimations for Micro- and Nanotechnology |
Abo... |
1st Biotechnology... |
Dubai, UAR |
02/2012 |
| Mikrodeformationsanalyse zur Zuverlässigkeitsbewertung mittels Grauwer... |
Michel, B.;... |
19. Disskusionssitzung... |
Bad... |
05/2001 |
| A new Method for Local Stress Field Analysis near Cracks in Micro- and... |
Michel,B.,... |
16. European... |
Alexandroupo... |
06/2006 |
| Evaluation of Microcracks in Microelectronic Components |
Michel, B.;... |
15. European Conferenz... |
Stockholm |
08/2004 |
| Rissvermeidungsstrategien in Werkstoffen mit Kunststoffen |
Michel,B.;Faust... |
13. Problemseminar... |
Merseburg |
06/2011 |
| Clearingstelle für Automobilelektronik Berlin- Wissenschaftliche Kompe... |
Michel,B. |
13.... |
Berlin |
01/2006 |
| Fatigue Crack Evaluation in Electronics |
Michel, B.;... |
12th International... |
Miskolc |
03/1994 |
| Crack and delamination Risk Evaluation of thin Silicon Based Microelec... |
Auersperg,J.,... |
11th. Internat. Conf.... |
Torino,... |
03/2005 |
