| Untersuchungen zur Zuverlässigkeit von Chipkarten |
Michel, B.;... |
Tagung Fachausschuß... |
Bayersoien |
05/1996 |
| Microsecurity and Nanosecurity- Security Research Using the Advantages... |
Michel,B.;... |
2nd. European Conf.... |
Barcelona,... |
04/2008 |
| Thermo-mechanical Reliability Analysis on Solder Joints of Ceramic Com... |
Dudek,R.,... |
3rd. International... |
Barcelona,... |
06/2005 |
| Mikrodeformationsanalyse zur Zuverlässigkeitsbewertung mittels Grauwer... |
Michel, B.;... |
19. Disskusionssitzung... |
Bad... |
05/2001 |
| Lifetime Prediction for Advanced Packaging based on Physics of Failure... |
Wunderle,B.,... |
Int. Symp. on Advanced... |
Atlanta, USA |
03/2006 |
| FibDAC Stress Relief - a Novel Stress Measurement Approach for Semicon... |
Vogel, D;... |
Microtech/Nanotech... |
Anaheim, USA |
10/2010 |
| Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN,
... |
Michel,B.;... |
Microtech/Nanotech... |
Anaheim, USA |
06/2010 |
| A new Method for Local Stress Field Analysis near Cracks in Micro- and... |
Michel,B.,... |
16. European... |
Alexandroupo... |
06/2006 |
| Nanoreliability- Fracture Mechanics on the Way from Micro to Nano |
Michel,B.,... |
Invited Plenary... |
Alexandroupo... |
06/2006 |
| Cracks in Micro- and nanoelectronics |
Michel, B.,... |
Symposium, 16.... |
Alexandroupo... |
06/2006 |
| The microDAC deformation analysis - a new method for testing and evalu... |
Michel, B.;... |
6th Int. Conf. On... |
Aachen,... |
05/2001 |
| Interface-Risse in Komponenten der Mikro- und Nanoelektronik |
Michel,B.;... |
36. Tagung des DVM... |
Aachen |
02/2006 |
| Risse in Packagingaufbauten- Von der Mikromechanik zur Nanomechanik |
Michel, B.,... |
N/A |
N/A |
01/1970 |
