| 'Microsecurity'- eine europäische Initiative zum Thema Mikro- und Nano... |
Michel,B.,... |
Werkstoffwoche 2004,... |
München |
09/2004 |
| 'NanoDAC- a New Technique for Micro-and Nanomechanical Reliability Ana... |
Michel,B.,... |
Internat. Conf. on... |
Toronto,... |
05/2005 |
| A new Approach to Measure Local Residual Stresses |
Vogel,D.,... |
N/A |
Dresden |
01/1970 |
| A new Method for Local Stress Field Analysis near Cracks in Micro- and... |
Michel,B.,... |
16. European... |
Alexandroupo... |
06/2006 |
| Accelerated Failure Test for High- T Applications of Power Mosfet by P... |
Schacht,R.,... |
International Workshop... |
Belgirate,... |
09/2005 |
| Advances in Micro-and Nanotechnologies- reliability Issues, Testing an... |
Michel,B. |
Lecture, University of... |
Belgrade,... |
12/2004 |
| Aktivitäten zur lokalen Deformationsanalyse für Mikro- und Nanokompone... |
Michel, B.;... |
DVM AK Treffen... |
Geesthacht,... |
10/2008 |
| Anforderungen aus der Nanotechnologie an die Zuverlässigkeitskonzepte ... |
Michel,B.,... |
1.DVM Konferenz... |
Darmstadt |
03/2006 |
| Anforderungen, Möglichkeiten, Trends von Nano- und Mikrotechniken |
Michel,B. |
Kooperationsforum... |
München |
03/2007 |
| Application of Fracture Mechanics for the Reliability Analysis of Asse... |
Shirangi, H.,... |
Conference Micro Car... |
Leipzig |
02/2013 |
| Application of Fracture Mechanics to Microsystem Technology |
Michel, B.;... |
VIII International... |
Kiev, Russia |
06/1993 |
| Aspects of Chip Package Interaction and 3D Integration Assessed by the... |
Auersperg, J.;... |
2011 IEEE... |
Dresden |
05/2011 |
| Automotive Electronics and Related Nanoreliability Electronics |
Michel,B.;... |
1. Intern. Congress... |
Torino |
06/2010 |
| Beanspruchungsanalyse und Zuverlässigkeitsbewertung von Komponenten de... |
Michel, B. |
Jahrestagung der... |
Göttingen,... |
04/2000 |
| Bewertung von Zuverlässigkeit und Lebensdauer von Komponenten und Syst... |
Michel, B. |
GMM Workshop... |
Erfurt |
03/2010 |
| Bruchmechanische Untersuchungen zur Zuverlässigkeitsbewertung mikrotec... |
Michel, B.;... |
Jahrestagung des AK... |
Köln,... |
02/1995 |
| Capabilities of Incorporating Bulk Fracture, Bimaterial Interface and ... |
Auersperg, J.;... |
7th. Internat. Conf.... |
ICEPT 2006,... |
08/2006 |
| Characterization approaches of nanoscale modified plastics |
Vogel,D.,... |
4th IEEE Conference on... |
Munich |
08/2004 |
| Clean Sky-europäische Technologiedemonstration
für grüneren Luftverke... |
Kaulfersch,... |
Internat. Conference... |
Leipzig |
02/2013 |
| Clearingstelle für Automobilelektronik Berlin- Wissenschaftliche Kompe... |
Michel,B. |
13.... |
Berlin |
01/2006 |
| Collaborative Research Amount Institutes, SME's & Multi-Nationals; inv... |
Michel, B. |
Management Research... |
Edinburgh |
04/2004 |
| Combination of Finite Element Simulation with Micro Deformation Measur... |
Michel, B.;... |
Conf. MICROSIM '95 |
Southampton,... |
10/1995 |
| Crack and delamination Risk Evaluation of thin Silicon Based Microelec... |
Auersperg,J.,... |
11th. Internat. Conf.... |
Torino,... |
03/2005 |
| Crack Avoidance and Crack Evaluation in Mikrosystems |
Michel, B. |
Int. Conf. Mikrosystem... |
Postdam,... |
12/1998 |
| Cracks in Micro- and nanoelectronics |
Michel, B.,... |
Symposium, 16.... |
Alexandroupo... |
06/2006 |
| Das Fraunhofer MicroMaterials Center stellt sich vor |
Winkler,T.,... |
Werkstoffwoche 2004 |
München |
09/2004 |
| Das Innovationspotential der Fraunhofer-Gesellschaft, dargestellt am B... |
Michel, B. |
Unternehmer-Seminar... |
Hamburg,... |
06/2002 |
| Defekte in Festkörpern, Pseudopotentiale und Zuverlässigkeits-Diskussi... |
Michel, B. |
Sommerfeld Seminar |
Leipzig |
02/2015 |
| Die Clearingstelle Automobilelektronik |
Michel,B. |
AK Steuern und Regeln... |
Technologies... |
03/2006 |
| Die Kontinuitätsgleichung in der Mikro- und Makrowelt- Anwendungen in ... |
Michel,B.,... |
Symposium... |
Leipzig |
11/2003 |
| Die Möglichkeiten der FIB-Technik zur Schadensanalyse an bleifreien Lo... |
Faust,W.,... |
39.... |
Erlangen |
09/2005 |
| Die Rolle der Mechanik für die Mikrosystemtechnik - Trends, Perspektiv... |
Michel, B. |
Symp. 'Mechanik der... |
Pfäffikon,... |
11/2002 |
| Digital Image Correlation Analysis on the Way from Micro to Nano |
Michel, B. |
Fair and Congress,... |
Berlin |
03/2006 |
| Einsatzmöglichkeiten von Lasermeßtechniken zur Werkstoffcharakterisier... |
Michel, B.;... |
Vortrag im... |
Dresden,... |
02/1996 |
| Erfahrungen aus der Zuverlässigkeitsforschung im Bereich
Medizintechn... |
knüppel, J.;... |
Internat. Conference... |
Leipzig |
02/2013 |
| Ermittlung von Eigenspannungen im Mikro- und Nanobereich |
Michel, B. |
Invited Plenary... |
Lichtenwalde... |
10/2005 |
| EUCEMAN- a powerful promotor of micro- and nanoreliability research |
Michel, B.;... |
Internat. Conf. Micro... |
Leipzig |
02/2013 |
| EUCEMAN- the European Center for MicroNanoReliability |
Michel, B.;... |
Nanoscience 2012,... |
Lichtenwalde... |
04/2012 |
| Evaluation of Microcracks in Microelectronic Components |
Michel, B.;... |
15. European Conferenz... |
Stockholm |
08/2004 |
| Experimental Mechanics on the Way from Micro to Nano |
Michel, B. |
Invited Open Lecture |
Chalmers... |
11/2005 |
| Experimental Mechanics on the Way from Micro to Nano, invited plenary ... |
Michel,B. |
Internat. Conference... |
Singapore |
11/2004 |
| Experimental Testing and Reliability Analysis of Electronic Packaging |
Walter,H.;... |
SMT China |
Shanghai,... |
09/2007 |
| Experimentelle und theoretische Methoden zur Bewertung der mechanische... |
Michel, B. |
Vortrag am Institut... |
Dresden,... |
01/1995 |
| Fatigue Crack Evaluation in Electronics |
Michel, B.;... |
12th International... |
Miskolc |
03/1994 |
| FibDAC Stress Relief - a Novel Stress Measurement Approach for Semicon... |
Vogel, D;... |
Microtech/Nanotech... |
Anaheim, USA |
10/2010 |
| FIBDAC- ein leistungsfähiges Messverfahren zur Ermittlung von lokalen ... |
Michel,B. |
24. ITG Tagung... |
Grainau |
05/2006 |
| FIBDAC-ein leistungsfähiges Messverfahren zur ermittlung von lokalen E... |
Michek,B. |
ITG Conferenz... |
Grainau |
01/1970 |
| Fracture and Fatigue Behaviour of MEMS-Related Micromaterials |
Walter,H.,... |
11.International... |
Torino,... |
03/2005 |
| Fracture Electronics - Application of Fracture Mechanics to Microelect... |
Michel, B.;... |
9th International... |
Sydney,... |
04/1997 |
| Fracture Electronics - Fracture Analysis of Microelectronic Components |
Michel, B.;... |
11th European... |
Futuroscope,... |
09/1996 |
