| Three-Dimensional Deformation Analysis of MEMS/NEMS by means of
x-Ray... |
Hammacher,... |
Microtech/Nanotech... |
Boston, USA |
06/2011 |
| Thermische und thermomechanische Voroptimierung mittels Finite
Elemen... |
Michel, B. |
Workshop Thermal... |
Hanau |
03/2010 |
| Testing and Reliability Issues in Nanomechanics |
Michel, B. |
Viennano 09, 3rd.... |
Vienna,... |
03/2009 |
| Towards a Robust Design of Electronics Assemblies under Fracture, Dela... |
Auersperg,J.;... |
9th.Electronic... |
Singapur |
12/2007 |
| Thermo-Mechanical Reliability of 3D-Integrated Microstructures in Stac... |
Wunderle,B.;Kau... |
MRS Annual Conference |
Boston, USA |
11/2006 |
| Thermo-mechanical Reliability Analysis on Solder Joints of Ceramic Com... |
Dudek,R.,... |
3rd. International... |
Barcelona,... |
06/2005 |
| Testing at Micro and Nanoscale |
Michel,B. |
Invited Paper,... |
Nürnberg |
05/2005 |
| The microDAC deformation analysis - a new method for testing and evalu... |
Michel, B.;... |
6th Int. Conf. On... |
Aachen,... |
05/2001 |
| Thermomechanische Verträglichkeitsanalysen (TMV) an Komponenten und Sy... |
Michel, B.;... |
9. Workshop AK... |
Schwieberdin... |
10/2000 |
| Thermo-Mechanical Reliability of Microelectronic Components |
Michel, B.;... |
3rd Euromech Solid... |
Stockholm,... |
08/1997 |
| Thermal Stresses in Electronic Packages and Chipcards |
Michel, B.;... |
2nd International... |
Rochester,... |
06/1997 |
| Thermomechanical Behaviour of Chipcard Materials |
Michel, B.;... |
5th European... |
Maastricht,... |
04/1997 |
| Test, Characterization and Reliability of Microsystems |
Michel, B.;... |
Short Course... |
Stuttgart,... |
10/1996 |
| Thermo-mechanical Reliability of Chip Size Packages |
Michel, B.;... |
Conference Microsystem... |
Potsdam,... |
09/1996 |
