| Nanoreliability for Mechanically Loaded Devices |
Vogel,D.,... |
International Congress... |
San... |
11/2005 |
| Fracture Mechanics Characterization of Micro-and Nanofilled Polymers b... |
Vogel,D.,Keller... |
World Congress... |
Munich |
01/1970 |
| Stress Measurement in Thin Multilayer Systems
by Stress Relief |
Vogel,D.;... |
Internat. Conf. Micro... |
Leipzig |
02/2013 |
| Fracture and Fatigue Behaviour of MEMS-Related Micromaterials |
Walter,H.,... |
11.International... |
Torino,... |
03/2005 |
| Experimental Testing and Reliability Analysis of Electronic Packaging |
Walter,H.;... |
SMT China |
Shanghai,... |
09/2007 |
| Das Fraunhofer MicroMaterials Center stellt sich vor |
Winkler,T.,... |
Werkstoffwoche 2004 |
München |
09/2004 |
| Mechanische und thermische Simulation in der Aufbau- und Verbindungste... |
Wittler, O.;... |
SMT/Hybrid/Packaging |
Nürnberg |
05/2011 |
| Lifetime Prediction for Advanced Packaging based on Physics of Failure... |
Wunderle,B.,... |
Int. Symp. on Advanced... |
Atlanta, USA |
03/2006 |
| Fracture mechanical characterization of micro-and nanofilled polymers ... |
Wunderle,B.,... |
4th. IEEE Conference... |
Munich |
08/2004 |
| Physics of Failure-basierte Lebensdauervorhersage im Mikro-Nano-Überga... |
Wunderle,B.,... |
24. Tagung... |
Grainau,... |
05/2006 |
| Reliability Concepts for Microsystems Integration |
Wunderle,B.;... |
European Conference... |
Brussels,... |
03/2009 |
| Thermo-Mechanical Reliability of 3D-Integrated Microstructures in Stac... |
Wunderle,B.;Kau... |
MRS Annual Conference |
Boston, USA |
11/2006 |
| Monte Carlo simulation of x-ray scattering and diffraction at packaged... |
Zschenderlein,... |
MSE-Materials Science... |
Darmstadt |
09/2012 |
