| Die Möglichkeiten der FIB-Technik zur Schadensanalyse an bleifreien Lo... |
Faust,W.,... |
39.... |
Erlangen |
09/2005 |
| Numerical Analysis for Thermo-Mechanical Reliability of Polymeric Appl... |
Dudek,R.;Walter... |
Polytronics 2007 Conf. |
Tokyo, Japan |
01/2007 |
| Thermo-mechanical Reliability Analysis on Solder Joints of Ceramic Com... |
Dudek,R.,... |
3rd. International... |
Barcelona,... |
06/2005 |
| Secupart- Deformationsanalyse mit digitaler Bildkorrelation für Nano b... |
Dost,M.,... |
NEMO-... |
Jena |
03/2006 |
| Nanoadhesives |
Bauer, M.,... |
Nanotrend 2004 |
Munich |
05/2004 |
| Nonlinear Copper Behaviour of TSV and the Cracking Risk during BEoL Bu... |
Auersperg,J.;Vo... |
EuroSimE 2012,... |
Lissabon,... |
04/2012 |
| Towards a Robust Design of Electronics Assemblies under Fracture, Dela... |
Auersperg,J.;... |
9th.Electronic... |
Singapur |
12/2007 |
| Crack and delamination Risk Evaluation of thin Silicon Based Microelec... |
Auersperg,J.,... |
11th. Internat. Conf.... |
Torino,... |
03/2005 |
| Aspects of Chip Package Interaction and 3D Integration Assessed by the... |
Auersperg, J.;... |
2011 IEEE... |
Dresden |
05/2011 |
| Zum Einsatz neuer Verfahren zur Rissbewertung und
Rissfortschrittsunt... |
Auersperg, J.;... |
Internat. Conf. Micro... |
Leipzig |
02/2013 |
| Capabilities of Incorporating Bulk Fracture, Bimaterial Interface and ... |
Auersperg, J.;... |
7th. Internat. Conf.... |
ICEPT 2006,... |
08/2006 |
| Reliability and Safety Estimations for Micro- and Nanotechnology |
Abo... |
1st Biotechnology... |
Dubai, UAR |
02/2012 |
| Reliability in the Micro-Nano-Region, Concepts, Trends and Application... |
N/A |
MiNAT 2007 |
Stuttgart |
06/2007 |
