| Monte Carlo simulation of x-ray scattering and diffraction at packaged... |
Zschenderlein,... |
MSE-Materials Science... |
Darmstadt |
09/2012 |
| Thermo-Mechanical Reliability of 3D-Integrated Microstructures in Stac... |
Wunderle,B.;Kau... |
MRS Annual Conference |
Boston, USA |
11/2006 |
| Reliability Concepts for Microsystems Integration |
Wunderle,B.;... |
European Conference... |
Brussels,... |
03/2009 |
| Physics of Failure-basierte Lebensdauervorhersage im Mikro-Nano-Überga... |
Wunderle,B.,... |
24. Tagung... |
Grainau,... |
05/2006 |
| Fracture mechanical characterization of micro-and nanofilled polymers ... |
Wunderle,B.,... |
4th. IEEE Conference... |
Munich |
08/2004 |
| Lifetime Prediction for Advanced Packaging based on Physics of Failure... |
Wunderle,B.,... |
Int. Symp. on Advanced... |
Atlanta, USA |
03/2006 |
| Mechanische und thermische Simulation in der Aufbau- und Verbindungste... |
Wittler, O.;... |
SMT/Hybrid/Packaging |
Nürnberg |
05/2011 |
| Das Fraunhofer MicroMaterials Center stellt sich vor |
Winkler,T.,... |
Werkstoffwoche 2004 |
München |
09/2004 |
| Experimental Testing and Reliability Analysis of Electronic Packaging |
Walter,H.;... |
SMT China |
Shanghai,... |
09/2007 |
| Fracture and Fatigue Behaviour of MEMS-Related Micromaterials |
Walter,H.,... |
11.International... |
Torino,... |
03/2005 |
| Stress Measurement in Thin Multilayer Systems
by Stress Relief |
Vogel,D.;... |
Internat. Conf. Micro... |
Leipzig |
02/2013 |
| Fracture Mechanics Characterization of Micro-and Nanofilled Polymers b... |
Vogel,D.,Keller... |
World Congress... |
Munich |
01/1970 |
| Nanoreliability for Mechanically Loaded Devices |
Vogel,D.,... |
International Congress... |
San... |
11/2005 |
| A new Approach to Measure Local Residual Stresses |
Vogel,D.,... |
N/A |
Dresden |
01/1970 |
| Characterization approaches of nanoscale modified plastics |
Vogel,D.,... |
4th IEEE Conference on... |
Munich |
08/2004 |
| FibDAC Stress Relief - a Novel Stress Measurement Approach for Semicon... |
Vogel, D;... |
Microtech/Nanotech... |
Anaheim, USA |
10/2010 |
| Numerical Characterization of Electronic Packaging Solutions based on ... |
Sommer,J.-P.,... |
6th. Internat. Conf.... |
Shenzen,... |
08/2005 |
| Application of Fracture Mechanics for the Reliability Analysis of Asse... |
Shirangi, H.,... |
Conference Micro Car... |
Leipzig |
02/2013 |
| Stress Chip Measurements of Internal Package Stresses for Process Char... |
Schindler-Saefk... |
EuroSimE 2012,... |
Lissabon,... |
04/2012 |
| Reliability Characterization by Stress Chip Measurements |
Schindler-Saefk... |
MSE-Materials Science... |
Darmstadt |
09/2012 |
| Accelerated Failure Test for High- T Applications of Power Mosfet by P... |
Schacht,R.,... |
International Workshop... |
Belgirate,... |
09/2005 |
| Influence of rate-dependent material data on the reliability of advanc... |
Poshtan, E.;... |
MSE Materials Science... |
Darmstadt |
09/2012 |
| Röntgen-Computertomographie(CT)- Werkzeug für die
Zustands- und Schad... |
Noack, E.;... |
Int. Conf. Micro Car... |
Leipzig |
02/2013 |
| Zuverlässigkeitsprobleme im Hightech-Bereich- Lösungsansätze und Konze... |
Michel; B. |
Leibniz Societät,... |
Berlin |
12/2006 |
| Microreliability, Nanoreliability-Reliability Issues for MEMS |
Michel.B. |
1st. Int. Forum on... |
Potsdam |
12/2003 |
| Security Assistance Systems- Security Support by Integration of Sensor... |
Michel,B.;Winkl... |
Safety and Security... |
Potsdam |
11/2006 |
| Rissvermeidungsstrategien für Mikrosysteme aus Werkstoffverbunden mit ... |
Michel,B.;Winkl... |
11. Chemnitzer... |
Chemnitz |
10/2012 |
| From Microelectronics to Nanoelectronics- Reliability and Packaging Is... |
Michel,B.;Reich... |
SEMI, Nanoelectronics... |
Munich |
04/2006 |
| Reliability of Electronics in Aviation |
Michel,B.;Kaulf... |
3rd. Dresden Airport... |
Dresden |
12/2007 |
| Rissvermeidungsstrategien in Werkstoffen mit Kunststoffen |
Michel,B.;Faust... |
13. Problemseminar... |
Merseburg |
06/2011 |
| Nanoreliability- Zuverlässigkeitskonzepte für den Mikro-Nano-Übergangs... |
Michel,B.;... |
3rd Leibniz Conference... |
Lichtenwalde |
11/2007 |
| Microsecurity,Nanosecurity-Security Research in Europe Utilizing Advan... |
Michel,B.;... |
3rd. Leibniz... |
Lichtenwalde |
11/2007 |
| Micro-and Nanosecurity-Security by Miniaturization in Microsystem Tech... |
Michel,B.;... |
Mikrosystemtechnik... |
Dresden |
10/2007 |
| Microsecurity and Nanosecurity- Security Research Using the Advantages... |
Michel,B.;... |
2nd. European Conf.... |
Barcelona,... |
04/2008 |
| Micro-Nano-Systems, Applications and State of the Art |
Michel,B.;... |
5th. Int. Conf. New... |
Sibiu,... |
09/2007 |
| Automotive Electronics and Related Nanoreliability Electronics |
Michel,B.;... |
1. Intern. Congress... |
Torino |
06/2010 |
| Verformungsanalyse mit Computertomographie |
Michel,B.;... |
10.Tagung... |
Chemnitz |
10/2010 |
| Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN,
... |
Michel,B.;... |
Microtech/Nanotech... |
Anaheim, USA |
06/2010 |
| Nanoscale Deformation Measurements- Concepts for Failure and Reliabili... |
Michel,B.;... |
NSTL Nanotechnology... |
Boston |
06/2008 |
| Interface-Risse in Komponenten der Mikro- und Nanoelektronik |
Michel,B.;... |
36. Tagung des DVM... |
Aachen |
02/2006 |
| Zuverlässigkeit von komponenten der Mikrosystemtechnik durch die Einbe... |
Michel,B.,... |
Tagung Mikromechanik... |
Chemnitz |
10/2005 |
| Simulation and Reliability on the Way from Micro to Nano |
Michel,B.,... |
21st. CAD-FEM Users... |
Potsdam,... |
11/2003 |
| Die Kontinuitätsgleichung in der Mikro- und Makrowelt- Anwendungen in ... |
Michel,B.,... |
Symposium... |
Leipzig |
11/2003 |
| Werkstoffmechanik- Zuverlässigkeit, Test und Designmethoden im Mikro- ... |
Michel,B.,... |
Symposium 10 Jahre... |
Teltow |
09/2003 |
| 'Microsecurity'- eine europäische Initiative zum Thema Mikro- und Nano... |
Michel,B.,... |
Werkstoffwoche 2004,... |
München |
09/2004 |
| Zuverlässigkeitsbewertung von MEMS-Komponenten im Mikro.Nano-Übergangs... |
Michel,B.,... |
Tagung... |
Lichtenwalde |
11/2003 |
| Microsecurity- Sicherheit durch Miniaturisierung mit Sensorik und Mikr... |
Michel,B.,... |
BMBF Workshop zur... |
Bonn |
05/2006 |
| NanoDAC-Messverfahren zur Verformungs- und Rissanalyse im extremen Mik... |
Michel,B.,... |
Jahresmitgliederversamm... |
Dresden |
02/2005 |
| Materials Characterization and Reliability Estimation of Solder Joints... |
Michel,B.,... |
EU-COST Meeting... |
Lausanne,... |
02/2005 |
| A new Method for Local Stress Field Analysis near Cracks in Micro- and... |
Michel,B.,... |
16. European... |
Alexandroupo... |
06/2006 |
