MicroDAC and NanoDAC- poweful techniques for nodestructive microcrack ... |
Michel,B.,... |
Int. Conf. SPIE,... |
San Diego,... |
02/2002 |
Schädigungskonzepte, Schädigungsvermeidung und Lebensdaueroptimierung ... |
Michel, B.;... |
DVS/GMM-Tagung... |
Fellbach,... |
03/2002 |
Micro Materials Center Berlin - Reliability Research for MEMS |
Michel, B.;... |
SPIE Conf.... |
San Diego,... |
03/2002 |
micro Materials Center Berlin, Reliability Research for MEMS |
Michel, B.;... |
Int. Symp. SPIE, Conf.... |
San Diego,... |
03/2002 |
MicroDAC and nanoDAC - Powerful Techniques for Nondestructiv Microcrac... |
Michel, B.;... |
Int. Symp. SPIE, Conf.... |
San Diego,... |
03/2002 |
NanoDAC - a new experimental method for reliability analysis in advanc... |
Michel, B.;... |
4th Int. Workshop Area... |
Berlin,... |
04/2002 |
Informationssysteme, Mikrosystemtechnik und Zuverlässigkeit |
Michel, B. |
Symp. 'Physik,... |
Leipzig,... |
06/2002 |
Das Innovationspotential der Fraunhofer-Gesellschaft, dargestellt am B... |
Michel, B. |
Unternehmer-Seminar... |
Hamburg,... |
06/2002 |
Zum Einsatz von Polymerwerkstoffen in der Mikrotechnik - Zuverlässigke... |
Michel, B.;... |
Polymerwerkstoffe 2002 |
Halle,... |
09/2002 |
Micro- and Nanomechanical Testing and Reliability Concepts für MEMS |
Michel, B.;... |
Materials Week, München |
München,... |
10/2002 |
Zuverlässigkeitsbewertung von Packagingaufbauten mittels microDAC- und... |
Michel, B. |
IMAPS-Konf., München |
München,... |
10/2002 |
Mikrodeformationsanalyse mit dem nanoDAC- Verfahren |
Michel, B. |
DVM AK Mechan.... |
Bundesanstal... |
10/2002 |
Mikrodeformationsanalyse mit dem nanoDAC-Verfahren |
Michel, B. |
DVM-AK 'Mechanische... |
Berlin,... |
10/2002 |
Die Rolle der Mechanik für die Mikrosystemtechnik - Trends, Perspektiv... |
Michel, B. |
Symp. 'Mechanik der... |
Pfäffikon,... |
11/2002 |
Packaging of Microsystems |
Michel, B.;... |
1st French-UK Workshop... |
Wyboston... |
01/2003 |
From Microreliability to Nanoreliability-Testing Concepts and Simulati... |
Michel,B. |
1. Internat. Conf. on... |
Berlin,... |
05/2003 |
Zuverlässigkeit und Lebensdauer im Mikro-Nano-Übergangsbereich |
Michel,B. |
Packaging Tag, 10... |
Berlin |
06/2003 |
Mikroelektronik und Mikrosystemtechnik - Anwendungenvon Mikro- und Nan... |
Michel, B. |
7. Sächsische... |
Leipzig,... |
06/2003 |
Werkstoffmechanik- Zuverlässigkeit, Test und Designmethoden im Mikro- ... |
Michel,B.,... |
Symposium 10 Jahre... |
Teltow |
09/2003 |
Nano Digital Image Correlation Method for Innovative Sensor Architectu... |
Keller, J.,... |
Workshop Scanning... |
Humboldt... |
09/2003 |
Reliability of Micro- and Nanosystems |
Michel,B. |
Micro.tec 2003 |
Munich |
10/2003 |
Die Kontinuitätsgleichung in der Mikro- und Makrowelt- Anwendungen in ... |
Michel,B.,... |
Symposium... |
Leipzig |
11/2003 |
Simulation and Reliability on the Way from Micro to Nano |
Michel,B.,... |
21st. CAD-FEM Users... |
Potsdam,... |
11/2003 |
Zuverlässigkeitsbewertung von MEMS-Komponenten im Mikro.Nano-Übergangs... |
Michel,B.,... |
Tagung... |
Lichtenwalde |
11/2003 |
Microreliability, Nanoreliability-Reliability Issues for MEMS |
Michel.B. |
1st. Int. Forum on... |
Potsdam |
12/2003 |
MicroDAC- ein Messverfahren zur Ermittlung von Werkstoffeigenschaften ... |
Michel,B.,... |
VDI/VDE-GMA Konferenz... |
Ludwigsburg |
03/2004 |
Collaborative Research Amount Institutes, SME's & Multi-Nationals; inv... |
Michel, B. |
Management Research... |
Edinburgh |
04/2004 |
Modulare Mikrosysteme und Packaging |
Michel,B.,... |
Fachkonferenz... |
Würzburg |
05/2004 |
Nanoadhesives |
Bauer, M.,... |
Nanotrend 2004 |
Munich |
05/2004 |
Zuverlässigkeit von Mikro bis Nano- Moderne Messtechniken und Simulati... |
Michel,B. |
Tutorial,... |
Nürnberg |
06/2004 |
Evaluation of Microcracks in Microelectronic Components |
Michel, B.;... |
15. European Conferenz... |
Stockholm |
08/2004 |
Characterization approaches of nanoscale modified plastics |
Vogel,D.,... |
4th IEEE Conference on... |
Munich |
08/2004 |
Fracture mechanical characterization of micro-and nanofilled polymers ... |
Wunderle,B.,... |
4th. IEEE Conference... |
Munich |
08/2004 |
Fracture Mechanical Characterization of Microcracks by Application of ... |
Keller,J.,... |
5th. European Symp. on... |
Hueckelhofen |
09/2004 |
'Microsecurity'- eine europäische Initiative zum Thema Mikro- und Nano... |
Michel,B.,... |
Werkstoffwoche 2004,... |
München |
09/2004 |
Das Fraunhofer MicroMaterials Center stellt sich vor |
Winkler,T.,... |
Werkstoffwoche 2004 |
München |
09/2004 |
Probleme der Zuverlässigkeit in der Elektronik |
Michel,B. |
9.... |
Schloss... |
09/2004 |
Reliability Issues of Nanomaterials in Automotive and MEMS Application... |
Michel,B. |
Austrian/German/French... |
Paris |
10/2004 |
Experimental Mechanics on the Way from Micro to Nano, invited plenary ... |
Michel,B. |
Internat. Conference... |
Singapore |
11/2004 |
Microreliability, Nanoreliability-Fracture Mechanics on the Way from M... |
Michel,B. |
Lecture, The Institute... |
Belgrade,... |
12/2004 |
Advances in Micro-and Nanotechnologies- reliability Issues, Testing an... |
Michel,B. |
Lecture, University of... |
Belgrade,... |
12/2004 |
NanoDAC-Messverfahren zur Verformungs- und Rissanalyse im extremen Mik... |
Michel,B.,... |
Jahresmitgliederversamm... |
Dresden |
02/2005 |
Microreliability,Nanoreliability-Zuverlässigkeitsbewertung von Mikro- ... |
Michel,B. |
37. Tagung des... |
Hamburg |
02/2005 |
Materials Characterization and Reliability Estimation of Solder Joints... |
Michel,B.,... |
EU-COST Meeting... |
Lausanne,... |
02/2005 |
Crack and delamination Risk Evaluation of thin Silicon Based Microelec... |
Auersperg,J.,... |
11th. Internat. Conf.... |
Torino,... |
03/2005 |
Fracture and Fatigue Behaviour of MEMS-Related Micromaterials |
Walter,H.,... |
11.International... |
Torino,... |
03/2005 |
Nanoreliability-Combined Simulation and Experiment |
Michel,B. |
EuroSime 2005,... |
Berlin |
04/2005 |
Testing at Micro and Nanoscale |
Michel,B. |
Invited Paper,... |
Nürnberg |
05/2005 |
'NanoDAC- a New Technique for Micro-and Nanomechanical Reliability Ana... |
Michel,B.,... |
Internat. Conf. on... |
Toronto,... |
05/2005 |
Thermo-mechanical Reliability Analysis on Solder Joints of Ceramic Com... |
Dudek,R.,... |
3rd. International... |
Barcelona,... |
06/2005 |