| Anforderungen, Möglichkeiten, Trends von Nano- und Mikrotechniken |
Michel,B. |
Kooperationsforum... |
München |
03/2007 |
| NanoDAC- Verformungsmessungen im Nanobereich |
Michel,B. |
Silicon Saxony Tag |
Dresden |
04/2007 |
| Zuverlässigkeit von Automobilsensorik durch Einsatz moderner Nanomesst... |
Michel,B. |
nano.tage des TÜV Süd |
München |
05/2007 |
| Reliability and Testing of Car Electronics |
Michel,B. |
Workshop on Precision... |
Helsinki |
06/2007 |
| Reliability in the Micro-Nano-Region, Concepts, Trends and Application... |
N/A |
MiNAT 2007 |
Stuttgart |
06/2007 |
| Zuverlässigkeit von Werkstoffverbunden mit Kunststoffkomponenten von m... |
Michel,B. |
11. Tagung... |
Merseburg |
06/2007 |
| MicroNanoReliability 2007 |
Michel,B.(ed.) |
1st. World Congress on... |
Berlin |
09/2007 |
| Micro-Nano-Systems, Applications and State of the Art |
Michel,B.;... |
5th. Int. Conf. New... |
Sibiu,... |
09/2007 |
| Experimental Testing and Reliability Analysis of Electronic Packaging |
Walter,H.;... |
SMT China |
Shanghai,... |
09/2007 |
| Micro-and Nanosecurity-Security by Miniaturization in Microsystem Tech... |
Michel,B.;... |
Mikrosystemtechnik... |
Dresden |
10/2007 |
| Microsecurity,Nanosecurity-Security Research in Europe Utilizing Advan... |
Michel,B.;... |
3rd. Leibniz... |
Lichtenwalde |
11/2007 |
| Nanoreliability- Zuverlässigkeitskonzepte für den Mikro-Nano-Übergangs... |
Michel,B.;... |
3rd Leibniz Conference... |
Lichtenwalde |
11/2007 |
| Reliability of Electronics in Aviation |
Michel,B.;Kaulf... |
3rd. Dresden Airport... |
Dresden |
12/2007 |
| Towards a Robust Design of Electronics Assemblies under Fracture, Dela... |
Auersperg,J.;... |
9th.Electronic... |
Singapur |
12/2007 |
| Micro-Nano-Macro- Simulation and Experiment, Packaging Reliability Est... |
Michel, B. |
Vortrag im... |
Wittenberg |
03/2008 |
| Kombination von Verformungsmesstechniken und Zuverlässigkeitsanalyse f... |
Michel, B.;... |
Silicon-Saxony Tag, |
Dresden |
03/2008 |
| Microsecurity and Nanosecurity- Security Research Using the Advantages... |
Michel,B.;... |
2nd. European Conf.... |
Barcelona,... |
04/2008 |
| Nanoscale Deformation Measurements at Crack Tips of Nanostructured
Ma... |
Keller, J.;... |
Nanotech 2008 |
Boston , USA |
06/2008 |
| Nanoscale Deformation Measurements- Concepts for Failure and Reliabili... |
Michel,B.;... |
NSTL Nanotechnology... |
Boston |
06/2008 |
| Aktivitäten zur lokalen Deformationsanalyse für Mikro- und Nanokompone... |
Michel, B.;... |
DVM AK Treffen... |
Geesthacht,... |
10/2008 |
| Micro Structures- Security and Reliability issues |
Michel, B.;... |
Nato Advanced Research... |
Portoroz,... |
10/2008 |
| Nanotechnologie- Spannung zwischen Forschung und Wirtschaft |
Michel, B. |
Symposium Wissens... |
Chemnitz |
11/2008 |
| Reliability Concepts for Microsystems Integration |
Wunderle,B.;... |
European Conference... |
Brussels,... |
03/2009 |
| Testing and Reliability Issues in Nanomechanics |
Michel, B. |
Viennano 09, 3rd.... |
Vienna,... |
03/2009 |
| Microsecurity- Sicherheit durch Mikro- und Nanotechnologien |
Michel, B. |
Silicon Saxony Day 2009 |
Dresden |
05/2009 |
| Bewertung von Zuverlässigkeit und Lebensdauer von Komponenten und Syst... |
Michel, B. |
GMM Workshop... |
Erfurt |
03/2010 |
| Thermische und thermomechanische Voroptimierung mittels Finite
Elemen... |
Michel, B. |
Workshop Thermal... |
Hanau |
03/2010 |
| Zuverlässigkeit-Lebensdauer-Sicherheit, die Zuverlässigkeitsforschung ... |
Michel, B. |
Seminar der... |
Leipzig |
04/2010 |
| Automotive Electronics and Related Nanoreliability Electronics |
Michel,B.;... |
1. Intern. Congress... |
Torino |
06/2010 |
| Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN,
... |
Michel,B.;... |
Microtech/Nanotech... |
Anaheim, USA |
06/2010 |
| Verformungsanalyse mit Computertomographie |
Michel,B.;... |
10.Tagung... |
Chemnitz |
10/2010 |
| FibDAC Stress Relief - a Novel Stress Measurement Approach for Semicon... |
Vogel, D;... |
Microtech/Nanotech... |
Anaheim, USA |
10/2010 |
| Mechanische und thermische Simulation in der Aufbau- und Verbindungste... |
Wittler, O.;... |
SMT/Hybrid/Packaging |
Nürnberg |
05/2011 |
| Aspects of Chip Package Interaction and 3D Integration Assessed by the... |
Auersperg, J.;... |
2011 IEEE... |
Dresden |
05/2011 |
| Fracture Mechanical Test Methods for Interface Crack Evaluation of
El... |
Keller,J.;... |
Microtech/Nanotech... |
Boston, USA |
06/2011 |
| Three-Dimensional Deformation Analysis of MEMS/NEMS by means of
x-Ray... |
Hammacher,... |
Microtech/Nanotech... |
Boston, USA |
06/2011 |
| Rissvermeidungsstrategien in Werkstoffen mit Kunststoffen |
Michel,B.;Faust... |
13. Problemseminar... |
Merseburg |
06/2011 |
| Reliability and Safety Estimations for Micro- and Nanotechnology |
Abo... |
1st Biotechnology... |
Dubai, UAR |
02/2012 |
| Nonlinear Copper Behaviour of TSV and the Cracking Risk during BEoL Bu... |
Auersperg,J.;Vo... |
EuroSimE 2012,... |
Lissabon,... |
04/2012 |
| Stress Chip Measurements of Internal Package Stresses for Process Char... |
Schindler-Saefk... |
EuroSimE 2012,... |
Lissabon,... |
04/2012 |
| EUCEMAN- the European Center for MicroNanoReliability |
Michel, B.;... |
Nanoscience 2012,... |
Lichtenwalde... |
04/2012 |
| Investigations about Annihilation of Gravity in the Micro-Nano Interfa... |
Michel, B. |
Nanoscience 2012,... |
Lichtenwalde... |
04/2012 |
| Some Comments on the Concepts of Nonlinear and Dynamic FractureMechani... |
Michel, B. |
Workshop Joint Lab... |
Berlin |
08/2012 |
| Fracture toughness measurements for interaces in microelectronic packa... |
Maus, I.;... |
MSE-Materials and... |
Darmstadt |
09/2012 |
| Influence of rate-dependent material data on the reliability of advanc... |
Poshtan, E.;... |
MSE Materials Science... |
Darmstadt |
09/2012 |
| Monte Carlo simulation of x-ray scattering and diffraction at packaged... |
Zschenderlein,... |
MSE-Materials Science... |
Darmstadt |
09/2012 |
| Reliability assurance by prevention of product counterfeiting: a new t... |
Luczak, F.;... |
MSE-Materials Science... |
Darmstadt |
09/2012 |
| Reliability Characterization by Stress Chip Measurements |
Schindler-Saefk... |
MSE-Materials Science... |
Darmstadt |
09/2012 |
| Möglichkeiten der Bruchmechanik für die Schadensvermeidung in den Bere... |
Michel, B.;... |
22. Wiss. Konferenz... |
Mittweida |
10/2012 |
| Rissvermeidungsstrategien für Mikrosysteme aus Werkstoffverbunden mit ... |
Michel,B.;Winkl... |
11. Chemnitzer... |
Chemnitz |
10/2012 |
