| Zuverlässigkeitsbewertung von Packagingaufbauten mittels microDAC- und... |
Michel, B. |
IMAPS-Konf., München |
München,... |
10/2002 |
| Micro- and Nanomechanical Testing and Reliability Concepts für MEMS |
Michel, B.;... |
Materials Week, München |
München,... |
10/2002 |
| Micro Materials Center Berlin - materials Research for MEMS Packaging |
Michel, B.;... |
Materials Week, München |
München,... |
10/2001 |
| Zuverlässigkeitsbewertung von mikroelektronischen Aufbauten unter Nutz... |
Michel, B. |
25. Deutsche... |
München,... |
10/1998 |
| Mikrosystemtechnik - Anwendung und Perspektiven |
Michel, B. |
Vortrag im Kolloquium,... |
München,... |
06/1995 |
| Mechanische und thermische Simulation in der Aufbau- und Verbindungste... |
Wittler, O.;... |
SMT/Hybrid/Packaging |
Nürnberg |
05/2011 |
| Testing at Micro and Nanoscale |
Michel,B. |
Invited Paper,... |
Nürnberg |
05/2005 |
| Zuverlässigkeit von Mikro bis Nano- Moderne Messtechniken und Simulati... |
Michel,B. |
Tutorial,... |
Nürnberg |
06/2004 |
| Reliability Issues of Nanomaterials in Automotive and MEMS Application... |
Michel,B. |
Austrian/German/French... |
Paris |
10/2004 |
| Reliability Analysis for Smart Systems on the Way from Micro to Nano |
Michel, B. |
Conference Smart... |
Paris,... |
03/2007 |
| MicroDAC and NanoDAC- New Experimental Testing Techniques for High-Tem... |
Michel,B. |
High Temperature... |
Paris,... |
09/2005 |
| Reliability Research in the Micro-Nano Region at the Fraunhofer MicroM... |
Michel,B. |
Meeting of EURELNET... |
Paris,... |
01/1970 |
| Die Rolle der Mechanik für die Mikrosystemtechnik - Trends, Perspektiv... |
Michel, B. |
Symp. 'Mechanik der... |
Pfäffikon,... |
11/2002 |
| Micro Structures- Security and Reliability issues |
Michel, B.;... |
Nato Advanced Research... |
Portoroz,... |
10/2008 |
| Crack Avoidance and Crack Evaluation in Mikrosystems |
Michel, B. |
Int. Conf. Mikrosystem... |
Postdam,... |
12/1998 |
| Security Assistance Systems- Security Support by Integration of Sensor... |
Michel,B. |
Conference on Safety &... |
Potsdam |
11/2006 |
| Security Assistance Systems- Security Support by Integration of Sensor... |
Michel,B.;Winkl... |
Safety and Security... |
Potsdam |
11/2006 |
| Microreliability, Nanoreliability-Reliability Issues for MEMS |
Michel.B. |
1st. Int. Forum on... |
Potsdam |
12/2003 |
| Simulation and Reliability on the Way from Micro to Nano |
Michel,B.,... |
21st. CAD-FEM Users... |
Potsdam,... |
11/2003 |
| Thermo-mechanical Reliability of Chip Size Packages |
Michel, B.;... |
Conference Microsystem... |
Potsdam,... |
09/1996 |
| Thermal Stresses in Electronic Packages and Chipcards |
Michel, B.;... |
2nd International... |
Rochester,... |
06/1997 |
| Local Deformation Analysis to Improve Reliability Assessment of Materi... |
Michel,B.,... |
11th. Annual SPIE... |
San Diego,... |
02/2006 |
| micro Materials Center Berlin, Reliability Research for MEMS |
Michel, B.;... |
Int. Symp. SPIE, Conf.... |
San Diego,... |
03/2002 |
| MicroDAC and nanoDAC - Powerful Techniques for Nondestructiv Microcrac... |
Michel, B.;... |
Int. Symp. SPIE, Conf.... |
San Diego,... |
03/2002 |
| Micro Materials Center Berlin - Reliability Research for MEMS |
Michel, B.;... |
SPIE Conf.... |
San Diego,... |
03/2002 |
| MicroDAC and NanoDAC- poweful techniques for nodestructive microcrack ... |
Michel,B.,... |
Int. Conf. SPIE,... |
San Diego,... |
02/2002 |
| Packaging Reliability on the Way from Micro to Nano |
Michel, B.,... |
Invited Plenary... |
San... |
11/2005 |
| Nanoreliability for Mechanically Loaded Devices |
Vogel,D.,... |
International Congress... |
San... |
11/2005 |
| Probleme der Zuverlässigkeit in der Elektronik |
Michel,B. |
9.... |
Schloss... |
09/2004 |
| Thermomechanische Verträglichkeitsanalysen (TMV) an Komponenten und Sy... |
Michel, B.;... |
9. Workshop AK... |
Schwieberdin... |
10/2000 |
| Experimental Testing and Reliability Analysis of Electronic Packaging |
Walter,H.;... |
SMT China |
Shanghai,... |
09/2007 |
| Numerical Characterization of Electronic Packaging Solutions based on ... |
Sommer,J.-P.,... |
6th. Internat. Conf.... |
Shenzen,... |
08/2005 |
| Micro-Nano-Systems, Applications and State of the Art |
Michel,B.;... |
5th. Int. Conf. New... |
Sibiu,... |
09/2007 |
| Experimental Mechanics on the Way from Micro to Nano, invited plenary ... |
Michel,B. |
Internat. Conference... |
Singapore |
11/2004 |
| Towards a Robust Design of Electronics Assemblies under Fracture, Dela... |
Auersperg,J.;... |
9th.Electronic... |
Singapur |
12/2007 |
| Combination of Finite Element Simulation with Micro Deformation Measur... |
Michel, B.;... |
Conf. MICROSIM '95 |
Southampton,... |
10/1995 |
| Evaluation of Microcracks in Microelectronic Components |
Michel, B.;... |
15. European Conferenz... |
Stockholm |
08/2004 |
| Thermo-Mechanical Reliability of Microelectronic Components |
Michel, B.;... |
3rd Euromech Solid... |
Stockholm,... |
08/1997 |
| Reliability in the Micro-Nano-Region, Concepts, Trends and Application... |
N/A |
MiNAT 2007 |
Stuttgart |
06/2007 |
| Test, Characterization and Reliability of Microsystems |
Michel, B.;... |
Short Course... |
Stuttgart,... |
10/1996 |
| Fracture Electronics - Application of Fracture Mechanics to Microelect... |
Michel, B.;... |
9th International... |
Sydney,... |
04/1997 |
| Reliability in Microsystems |
Michel, B.;... |
Baltic Electronics... |
Tallinn,... |
10/1996 |
| Die Clearingstelle Automobilelektronik |
Michel,B. |
AK Steuern und Regeln... |
Technologies... |
03/2006 |
| Werkstoffmechanik- Zuverlässigkeit, Test und Designmethoden im Mikro- ... |
Michel,B.,... |
Symposium 10 Jahre... |
Teltow |
09/2003 |
| Numerical Analysis for Thermo-Mechanical Reliability of Polymeric Appl... |
Dudek,R.;Walter... |
Polytronics 2007 Conf. |
Tokyo, Japan |
01/2007 |
| Mechanical Reliability of Microcomponents |
Michel, B. |
Advanced Technology... |
Tokyo, Japan |
02/1999 |
| Mechanical Reliability of Microcomponents |
Michel, B. |
Presentation of... |
Tokyo, Japan |
02/1999 |
| Automotive Electronics and Related Nanoreliability Electronics |
Michel,B.;... |
1. Intern. Congress... |
Torino |
06/2010 |
| Crack and delamination Risk Evaluation of thin Silicon Based Microelec... |
Auersperg,J.,... |
11th. Internat. Conf.... |
Torino,... |
03/2005 |
| Fracture and Fatigue Behaviour of MEMS-Related Micromaterials |
Walter,H.,... |
11.International... |
Torino,... |
03/2005 |
