Reliability Characterization by Stress Chip Measurements

Interne ID	202
Autor(en)	Schindler-Saefkow, F.; Rost, F.; Otto, A.; Winkler, T.; Rzepka, S.; Michel, B.
Veranstaltung	MSE-Materials Science and Engineering Congress, Symposium D3 Reliability
Ort	Darmstadt
Datum	25.09.2012
Enddatum	27.09.2012